期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024

2017, vol.29, no.1 2017, vol.29, no.2 2017, vol.29, no.3 2017, vol.29, no.4

题名作者出版年年卷期
Hardness testing of lead-free solders: a reviewYahaya, Muhamad Zamri; Mohamad, Ahmad Azmin20172017, vol.29, no.4
Effect of fluxes on Sn-Zn-Bi solder alloys on copper substrateNoor, Ervina Efzan Mhd; Ogundipe, Ayodeji Samson20172017, vol.29, no.4
Fuzzy logic approach for investigation of microstructure and mechanical properties of Sn96.5-Ag3.0-Cu0.5 lead free solder alloyAamir, Muhammad; Izhar; Waqas, Muhammad; Iqbal, Muhammad; Hanif, Muhammad Imran; Muhammad, Riaz20172017, vol.29, no.4
Thermal cycling effect on the drop reliability of BGA lead-free solder jointsLiu, Fang; Zhou, Jiacheng; Yan, Nu20172017, vol.29, no.4
CUF scaling effect on contact angle and threshold pressureNg, Fei Chong; Abas, Mohamad Aizat; Abdullah, M. Z.; Ishak, M. H. H.; Chong, Gean Yuen20172017, vol.29, no.4
Solder joint defect classification based on ensemble learningWu, Hao20172017, vol.29, no.3
Research on microstructure and mechanical behaviour of smaller microbumps for high density solder interconnectsHe, Man; Wang, Bo; Xia, Weisheng; Chen, Shijie; Zhu, Jinzhuan20172017, vol.29, no.3
Cu/SnAgCu/Cu TLP with different thicknesses for 3D ICZhang, Liang; Liu, Zhi-quan; Yang, Fan; Zhong, Su-juan20172017, vol.29, no.3
Reflow of tiny 01005 capacitor/SAC305 solder joints in protective atmosphereTao, Yeqing; Ding, Dongyan; Li, Ting; Guo, Jason; Fan, Guoliang20172017, vol.29, no.3
y Thermal decomposition of solder flux activators under simulated wave soldering conditionsPiotrowska, Kamila; Jellesen, Morten Stendahl; Ambat, Rajan20172017, vol.29, no.3
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