期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024

2017, vol.29, no.1 2017, vol.29, no.2 2017, vol.29, no.3 2017, vol.29, no.4

题名作者出版年年卷期
Study of direct soldering of silicon and copper substrate by use of Bi-based solders with lanthanides additionKolenak, Roman20172017, vol.29, no.3
y Thermal decomposition of solder flux activators under simulated wave soldering conditionsPiotrowska, Kamila; Jellesen, Morten Stendahl; Ambat, Rajan20172017, vol.29, no.3
Reflow of tiny 01005 capacitor/SAC305 solder joints in protective atmosphereTao, Yeqing; Ding, Dongyan; Li, Ting; Guo, Jason; Fan, Guoliang20172017, vol.29, no.3
Cu/SnAgCu/Cu TLP with different thicknesses for 3D ICZhang, Liang; Liu, Zhi-quan; Yang, Fan; Zhong, Su-juan20172017, vol.29, no.3
Research on microstructure and mechanical behaviour of smaller microbumps for high density solder interconnectsHe, Man; Wang, Bo; Xia, Weisheng; Chen, Shijie; Zhu, Jinzhuan20172017, vol.29, no.3
Solder joint defect classification based on ensemble learningWu, Hao20172017, vol.29, no.3



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