期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



全部

1995 1996 1997 1998 1999 2000
2001 2002 2003 2004 2005 2006
2007 2008 2009 2010 2011 2012
2013 2014 2015 2016 2017 2018
2019 2020 2021 2022 2023 2024

2017, vol.139, no.1 2017, vol.139, no.2 2017, vol.139, no.3 2017, vol.139, no.4

题名作者出版年年卷期
Ball Grid Array Interconnection Properties of Solderable Polymer-Solder Composites With Low-Melting-Point Alloy FillersShin, Young-Eui; Yim, Byung-Seung; Kim, Jong-Min20172017, vol.139, no.4
Solid-State Microjoining Mechanisms of Wire Bonding and Flip Chip BondingTakahashi, Yasuo; Fukuda, Hiroki; Yoneshima, Yasuhiro; Kitamura, Hideki; Maeda, Masakatsu20172017, vol.139, no.4
Effectiveness of Rack-Level Fans-Part I: Energy Savings Through ConsolidationNagendran, Bharath; Mulay, Veerendra; Agonafer, Dereje; Eiland, Richard; Fernandes, John Edward20172017, vol.139, no.4
Effects of Stacked Layers and Stacked Configurations on Wire Sweep and Wire Sag of Advanced Overhang/Pyramid Stacked PackagesHsieh, Chi-Lung; Kung, Huang-Kuang20172017, vol.139, no.4
Effectiveness of Rack-Level Fans-Part II: Control Strategies and System RedundancyFernandes, John Edward; Eiland, Richard; Nagendran, Bharath; Mulay, Veerendra; Agonafer, Dereje20172017, vol.139, no.4
Airflow Management on the Efficiency Index of a Container Data Center Having Overhead Air SupplyWang, Cheng-Hao; Tsui, Yeng-Yung; Wang, Chi-Chuan20172017, vol.139, no.4
Determination of Energy Release Rate Through Sequential Crack ExtensionMcCann, Scott; Ostrowicki, Gregory T.; Anh Tran; Huang, Timothy; Bernhard, Tobias; Tummala, Rao R.; Sitaraman, Suresh K.20172017, vol.139, no.4
Thermal Performance and Efficiency of a Mineral Oil Immersed Server Over Varied Environmental Operating ConditionsEiland, Richard; Fernandes, John Edward; Vallejo, Marianna; Siddarth, Ashwin; Agonafer, Dereje; Mulay, Verrendra20172017, vol.139, no.4
Ultraminiaturized Three-Dimensional IPAC Packages With 100 mu m Thick Glass Substrates for Radio Frequency Front-End ModulesWu, Zihan; Min, Junki; Smet, Vanessa; Pulugurtha, Markondeya Raj; Sundaram, Venky; Tummala, Rao R.20172017, vol.139, no.4
Enhanced Bonding by Applied Current in Cu-to-Cu Joints Fabricated Using 20 mu m Cu MicrobumpsShin, Chanho; Kim, Young-Ho; Ma, Sung Woo20172017, vol.139, no.4
12345



制造业外文文献服务平台