期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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2017, vol.139, no.1 2017, vol.139, no.2 2017, vol.139, no.3 2017, vol.139, no.4

题名作者出版年年卷期
Transient Analysis of Nonuniform Heat Input Propagation Through a Heat Sink BaseSudhakar, Srivathsan; Weibel, Justin A.20172017, vol.139, no.2
Mechanical Testing for Stretchable ElectronicsKlein, Steven A.; Aleksov, Aleksandar; Subramanian, Vijay; Malatkar, Pramod; Mahajan, Ravi20172017, vol.139, no.2
Carrier Mobility Shift in Advanced Silicon Nodes Due to Chip-Package InteractionSukharev, Valeriy; Choy, Jun-Ho; Kteyan, Armen; Hovsepyan, Henrik; Zhao, Wei; Radojcic, Riko; Muehle, Uwe; Zschech, Ehrenfried; Nakamoto, Mark20172017, vol.139, no.2
Heat Transfer in Liquid-Liquid Taylor Flow in Miniscale Curved Tubing for Constant Wall TemperatureAdrugi, Wesam; Muzychka, Yuri; Pope, Kevin20172017, vol.139, no.2
Effect of the Crystallinity on the Electromigration Resistance of Electroplated Copper Thin-Film InterconnectionsKato, Takeru; Suzuki, Ken; Miura, Hideo20172017, vol.139, no.2
Experimental and Numerical Investigation of Interdie Thermal Resistance in Three-Dimensional Integrated CircuitsChoobineh, Leila; Jones, Jared; Jain, Ankur20172017, vol.139, no.2
Experimental Development and Computational Optimization of Flat Heat Pipes for CubeSat ApplicationsIsaacs, Steven A.; Arias, Diego A.; Hengeveld, Derek; Hamlington, Peter E.20172017, vol.139, no.2
Special Section on IMECE 2016Weibel, Justin A.; Annapragada, S. Ravi20172017, vol.139, no.2
Assembly of Heterogeneous Materials for Biology and Electronics: From Bio-Inspiration to Bio-IntegrationGao, Yuyan; Cheng, Huanyu20172017, vol.139, no.2
High-Temperature Interfacial Adhesion Strength Measurement in Electronic Packaging Using the Double Cantilever Beam MethodMcCoy, David; Malatkar, Pramod; Sankarasubramanian, Santosh; Cruz, Jaime; Yazzie, Kyle; Sundar, Vaasavi; Subramanian, Vijay; Alazar, Tsgereda; Yagnamurthy, Sivakumar; Cetegen, Edvin20172017, vol.139, no.2
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