期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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2017, vol.139, no.1 2017, vol.139, no.2 2017, vol.139, no.3 2017, vol.139, no.4

题名作者出版年年卷期
The Effects of Silica Fillers on the Properties of Encapsulation Molding CompoundsLiaw, Yowching; Chou, Jung-Hua20172017, vol.139, no.3
Flow Boiling Heat Transfer and Pressure Drops of R1234ze(E) in a Silicon Micro-pin Fin EvaporatorFalsetti, C.; Magnini, M.; Thome, J. R.20172017, vol.139, no.3
Experimental Analysis of a Novel Piezoelectric Jetting System for Micrograms Deposition in Electronic AssembliesIyer, Rajiv L.; Santos, Daryl L.20172017, vol.139, no.3
Overview of Human Thermal Responses to Warm Surfaces of Electronic DevicesHedge, Alan; Zhang, Han20172017, vol.139, no.3
A Review on Laser Processing in Electronic and MEMS PackagingRahim, Kaysar; Mian, Ahsan20172017, vol.139, no.3
Influence of Secondary Impact on Printed Wiring Assemblies-Part II: Competing Failure Modes in Surface Mount ComponentsMeng, Jingshi; Dasgupta, Abhijit20172017, vol.139, no.3
Modified Constitutive Creep Laws With Micromechanical Modeling of Pb-Free Solder AlloysThambi, Joel; Schiessl, Andreas; Waltz, Manuela; Lang, Klaus-Dieter; Tetzlaff, Ulrich20172017, vol.139, no.3
Effect of Packaging Architecture on the Optical and Thermal Performances of High-Power Light Emitting DiodesLaw, Thong Kok; Lim, Fannon; Li, Yun; Puan, XuePeng; Sng, G. K. E.; Teo, J. W. Ronnie20172017, vol.139, no.3
Far Back End of Line Aluminum Stress Reduction Methods for Two-Dimensional/2.5D Fine Pitch AssembliesWassick, Thomas; Cournoyer, Maryse; Tunga, Krishna20172017, vol.139, no.3
Performance Assessment of Single and Multiple Jet Impingement Configurations in a Refrigeration-Based Compact Heat Sink for Electronics Coolingde Oliveira, Pablo A.; Barbosa, Jader R., Jr.20172017, vol.139, no.3
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