期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024

2018, vol.30, no.1 2018, vol.30, no.2 2018, vol.30, no.3 2018, vol.30, no.4

题名作者出版年年卷期
SAC-xTiO(2) nano-reinforced lead-free solder joint characterizations in ultra-fine package assemblyAni, Fakhrozi Che; Jalar, Azman; Saad, Abdullah Aziz; Khor, Chu Yee; Ismail, Roslina; Bachok, Zuraihana; Abas, Mohamad Aizat; Othman, Norinsan Kamil20182018, vol.30, no.1
Morphology transformation on Cu3Sn grains during the formation of full Cu3Sn solder joints in electronic packagingYao, Peng; Li, Xiaoyan; Jin, Fengyang; Li, Yang20182018, vol.30, no.1
Failure analysis of solder layer in power transistorJiang, Maogong; Fu, Guicui; Wan, Bo; Xue, Peng; Qiu, Yao; Li, Yanruoyue20182018, vol.30, no.1
A study on the effect of electromigration on solder alloy joint on copper with nickel surface finishNoor, Ervina Efzan Mhd; Baaljinder, R.; Emerson, J.20182018, vol.30, no.1
Stable interconnections for LTCC micro-heater using isothermal solidification techniqueKumar, Duguta Suresh; Suri, Nikhil; Khanna, P. K.20182018, vol.30, no.1
Rheological characterization of non-Brownian suspensions based on structure kineticsVachaparambil, Kurian J.; Martensson, Gustaf; Essen, Lars20182018, vol.30, no.1
Lead-free solder wettability of oxidized-aluminum enhanced by Ar-H-2 plasmas for flip-chip bumpingLin, Yung-Sen; Lin, Shiau-Min; Li, Jian-Yi; Liao, Min-Chih20182018, vol.30, no.1



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