期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



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2023 2024

2018, vol.30, no.1 2018, vol.30, no.2 2018, vol.30, no.3 2018, vol.30, no.4

题名作者出版年年卷期
Guest editorialSkwarek, Agata20182018, vol.30, no.2
Convection vs vapour phase reflow in LED and BGA assemblyDziurdzia, Barbara; Sobolewski, Maciej; Mikolajek, Janusz20182018, vol.30, no.2
Investigating the attack angle of squeegees with different geometriesKrammer, Oliver; Jakab, Laszlo; Illes, Balazs; Busek, David; Pelikanova, Ivana Beshajova20182018, vol.30, no.2
Residual free solder process for fluxless solder pastesHanss, Alexander; Elger, Gordon20182018, vol.30, no.2
Effects of high current density on lead-free solder joints of chip-size passive SMD componentsGeczy, Attila; Straubinger, Daniel; Kovacs, Andras; Krammer, Oliver; Mach, Pavel; Harsanyi, Gabor20182018, vol.30, no.2
In-Bi low-temperature SLID bonding for piezoelectric materialsEggen, Trym; Manh, Tung; Hoang-Vu Nguyen; Aasmundtveit, Knut E.20182018, vol.30, no.2
Effect of the vapour concentration decrease on the solder joints temperature in a vacuum vapour phase soldering systemIlles, Balazs; Skwarek, Agata; Geczy, Attila; Jakab, Laszlo; Busek, David; Dusek, Karel20182018, vol.30, no.2
Characterisation of Cu/Cu bonding using self-assembled monolayerLykova, Maria; Panchenko, Iuliana; Kuenzelmann, Ulrich; Reif, Johanna; Geidel, Marion; Wolf, M. Juergen; Lang, Klaus-Dieter20182018, vol.30, no.2
The influence of a soldering manner on thermal properties of LED modulesGorecki, Krzysztof; Dziurdzia, Barbara; Ptak, Przemyslaw20182018, vol.30, no.2
Fine line screen printed silver electrodes for copper electrodepositionDrabczyk, Kazimierz20182018, vol.30, no.2



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