期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



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1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024

2018, vol.30, no.1 2018, vol.30, no.2 2018, vol.30, no.3 2018, vol.30, no.4

题名作者出版年年卷期
Effects of Mn nanoparticle addition on wettability, microstructure and microhardness of low-Ag Sn-0.3Ag-0.7Cu-xMn(np) composite soldersTang, Yu; Luo, Shaoming; Li, Guoyuan; Yang, Zhou; Hou, Chaojun20182018, vol.30, no.3
Effects of solder paste on thermal and optical performance of high-power ThinGaN white LEDRaypah, Muna E.; Devarajan, Mutharasu; Sulaiman, Fauziah20182018, vol.30, no.3
Growth kinetics of IMC at the solid Cu/liquid Sn interfaceYin, Zuozhu; Sun, Fenglian; Liu, Yang20182018, vol.30, no.3
Reliability assessment of electronic assemblies under vibration by statistical factorial analysis approachGharaibeh, Mohammad20182018, vol.30, no.3
Diffusion of elements during reflow ageing of Sn-Zn solder in liquid state on Ni/Cu substrate - theoretical and experimental studyMittal, Jagjiwan; Lin, Kwang-Lung20182018, vol.30, no.3
Optimising pin-in-paste technology using gradient boosted decision treesMartinek, Peter; Krammer, Oliver20182018, vol.30, no.3
Deformation behavior relationship between tensile and nanoindentation tests of SAC305 lead-free solder wireAbdullah, Izhan; Zulkifli, Muhammad Nubli; Jalar, Azman; Ismail, R.20182018, vol.30, no.3



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