期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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2018, vol.140, no.1 2018, vol.140, no.2 2018, vol.140, no.3 2018, vol.140, no.4

题名作者出版年年卷期
Assessment of Elastic-Plastic and Electrical Properties of Printed Silver-Based Interconnects for Flexible ElectronicsCheng, Hsien-Chie; Hong, Ruei-You; Chen, Wen-Hwa20182018, vol.140, no.4
Accelerated Vibration Reliability Testing of Electronic Assemblies Using Sine Dwell With Resonance TrackingSu, Quang T.; Gharaibeh, Mohammad A.; Stewart, Aaron J.; Pitarresi, James M.; Anselm, Martin K.20182018, vol.140, no.4
Reactive Joining of Thermally and Mechanically Sensitive MaterialsRheingans, Bastian; Furrer, Roman; Neuenschwander, Juerg; Spies, Irina; Schumacher, Axel; Knappmann, Stephan; Janczak-Rusch, Jolanta; Jeurgens, Lars P. H.20182018, vol.140, no.4
Correlation of Warpage Distribution With the Material Property Scattering for Warpage Range Prediction of PBGA ComponentsZhang, Qiming; Lo, Jeffery C. C.; Lee, S. W. Ricky; Xu, Wei20182018, vol.140, no.4
Diagonal Mode van der Pauw Stress Sensors: Proof of Diagonal-Mode ConjectureJaeger, Richard C.; Suhling, Jeffrey C.; Chen, Jun20182018, vol.140, no.4
Error Reduction in Infrared Thermography by Multiframe Super-ResolutionChandramohan, Aditya; Lyons, Sara K.; Weibel, Justin A.; Garimella, Suresh, V20182018, vol.140, no.4
Reliability Analysis of Lead-Free Solders in Electronic Packaging Using a Novel Surrogate Model and Kriging ConceptAzizsoltani, Hamoon; Haldar, Achintya20182018, vol.140, no.4
Power and Thermal Constraints-Driven Modeling and Optimization for Through Silicon Via-Based Power Distribution NetworkDong, Gang; Yang, Yintang; Zhu, Weijun20182018, vol.140, no.4
Regional Stiffness Reduction Using Lamina Emergent Torsional Joints for Flexible Printed Circuit Board DesignDefigueiredo, Bryce P.; Zimmerman, Trent K.; Russell, Brian D.; Howell, Larry L.20182018, vol.140, no.4
Micro Copper Pillar Interconnection Using Thermosonic Flip Chip BondingZhang, Shuanghai; Wang, Fuliang; Chen, Zhuo; Wu, Bo20182018, vol.140, no.4
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