期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2023



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2018, vol.140, no.1 2018, vol.140, no.2 2018, vol.140, no.3 2018, vol.140, no.4

题名作者出版年年卷期
Impact of Tile Design on the Thermal Performance of Open and Enclosed AislesKhalili, Sadegh; Tradat, Mohammad I.; Nemati, Kourosh; Seymour, Mark; Sammakia, Bahgat20182018, vol.140, no.1
Lead-Free Alternatives for Interconnects in High-Temperature ElectronicsMallampati, Sandeep; Yin, Liang; Shaddock, David; Schoeller, Harry; Cho, Junghyun20182018, vol.140, no.1
Experimentally Validated Computational Fluid Dynamics Model for Data Center With Active TilesAthavale, Jayati; Joshi, Yogendra; Yoda, Minami20182018, vol.140, no.1
Application-Driven Reliability Research of Next Generation for Automotive Electronics: Challenges and ApproachesRzepka, Sven; Otto, Alexander; Vogel, Dietmar; Dudek, Rainer20182018, vol.140, no.1
Role of a Liquid Accumulator in a Passive Two-Phase Liquid Cooling System for Electronics: Experimental AnalysisLamaison, Nicolas; Amalfi, Raffaele L.; Salamon, Todd; Marcinichen, Jackson B.; Thome, John R.20182018, vol.140, no.1
Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors (vol 136, 041014, 2014)Jaeger, Richard C.; Motalab, Mohammad; Hussain, Safina; Suhling, Jeffrey C.20182018, vol.140, no.1
Special Section on InterPACK 2017-Part 1Mysore, Kaushik; Narumanchi, Sreekant; Dede, Ercan; Khiabani, Reza20182018, vol.140, no.1
Improvement of Thermo-Mechanical Reliability of Wafer-Level Chip Scale PackagingShi, Lei; Chen, Lin; Zhang, David Wei; Liu, Evan; Liu, Qiang; Chen, Ching-I20182018, vol.140, no.1
Thermal Metamaterials for Heat Flow Control in ElectronicsDede, Ercan M.; Zhou, Feng; Schmalenberg, Paul; Nomura, Tsuyoshi20182018, vol.140, no.1
Ripening Growth Kinetics of Cu6Sn5 Grains in Sn-3.0Ag-0.5Cu-xTiO(2)/Cu Solder Joints During the Reflow ProcessTang, Y.; Luo, S. M.; Li, G. Y.; Yang, Z.; Hou, C. J.20182018, vol.140, no.1
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