期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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2018, vol.140, no.1 2018, vol.140, no.2 2018, vol.140, no.3 2018, vol.140, no.4

题名作者出版年年卷期
Hybrid Nanocomposite Thermal Interface Materials: The Thermal Conductivity and the Packing DensityZhang, Tingling; Sammakia, Bahgat G.; Yang, Zhihao; Wang, Howard20182018, vol.140, no.3
A Wire-Bondless Packaging Platform for Silicon Carbide Power Semiconductor DevicesYin, Liang; Kapusta, Christopher; Gowda, Arun; Nagarkar, Kaustubh20182018, vol.140, no.3
Embedded Two-Phase Cooling of High Flux Electronics Via Press-Fit and Bonded FEEDS CoolersMandel, Raphael K.; Bae, Daniel G.; Ohadi, Michael M.20182018, vol.140, no.3
Edge Trimming Induced Defects on Direct Bonded WafersLnoue, Fumihiro; Jourdain, Anne; Peng, Lan; Phommahaxay, Alain; Kosemura, Daisuke; De Wolf, Ingrid; Rebibis, Kenneth June; Miller, Andy; Sleeckx, Erik; Beyne, Eric20182018, vol.140, no.3
Fabrication of Multimeasurand Sensor for Monitoring of a Li-ton BatteryKnobloch, Aaron; Kapusta, Chris; Karp, Jason; Plotnikov, Yuri; Siegel, Jason B.; Stefanopoulou, Anna G.20182018, vol.140, no.3
Interfacial Compounds Characteristic and Its Reliability Effects on SAC305 Microjoints in Flip Chip AssembliesTian, Ye; Ren, Ning; Jian, Xiaoxia; Geng, Tie; Wu, Yiping20182018, vol.140, no.3
Effect of Long-Term Room Temperature Aging on the Fatigue Properties of SnAgCu Solder JointSu, Sinan; Fu, Nianjun; Akkara, Francy John; Hamasha, Sa'd20182018, vol.140, no.3
Development of a High Cycle Fatigue Life Prediction Model for Thin Film Silicon StructuresChang, Chia-Cheng; Lin, Sheng-Da; Chiang, Kuo-Ning20182018, vol.140, no.3
Modeling of Moisture Transport Into an Electronic Enclosure Using the Resistor-Capacitor ApproachStaliulionis, Z.; Conseil-Gudla, H.; Mohanty, S.; Jabbari, M.; Ambat, R.; Hattel, J. H.20182018, vol.140, no.3



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