期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024

2019, vol.31, no.1 2019, vol.31, no.2 2019, vol.31, no.3 2019, vol.31, no.4

题名作者出版年年卷期
Stress analysis of pressure-assisted sintering for the double-side assembly of power moduleLiu, Yang; Zhang, Hao; Wang, Lingen; Fan, Xuejun; Zhang, Guoqi; Sun, F.20192019, vol.31, no.1
Shear strength and fracture mechanism for full Cu-Sn IMCs solder joints with different Cu3Sn proportion and joints with conventional interfacial structure in electronic packagingYao, Peng; Li, Xiaoyan; Han, Xu; Xu, Liufeng20192019, vol.31, no.1
Nickel effects on the structural and some physical properties of the eutectic Sn-Ag lead-free solder alloyGumaan, Mohammed S.; Shalaby, Rizk Mostafa; Yousef, Mustafa Kamal Mohammed; Ali, Esmail A. M.; Abdel-Hady, E. E.20192019, vol.31, no.1
Corrosion characterization of Sn-Zn solder: a reviewNazeri, Muhammad Firdaus Mohd; Yahaya, Muhamad Zamri; Gursel, Ali; Cheani, Fakhrozi; Masri, Mohamad Najmi; Mohamad, Ahmad Azmin20192019, vol.31, no.1
The effect of vacancy on the interfacial diffusion in Cu/Sn lead-free solder jointsLi Yang; Li Xiaoyan; Peng Yao20192019, vol.31, no.1
Microstructure of Sn-20In-2.8Ag solder and mechanical properties of joint with CuPeng, Fen; Liu, Wensheng; Ma, Yunzhu; Liang, Chaoping; Huang, Yufeng; Tang, Siwei20192019, vol.31, no.1
Effect of stearic acid coating on anti-oxidation property of Sn-Ag-Cu solder powderPeng, Fen; Liu, Wensheng; Huang, Yufeng; Tang, Siwei; Liang, Chaoping; Ma, Yunzhu20192019, vol.31, no.1



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