期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2023



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2019, vol.141, no.1 2019, vol.141, no.2 2019, vol.141, no.3 2019, vol.141, no.4

题名作者出版年年卷期
Reduced Order Modeling of Transient Heat Transfer in Microchip InterconnectsNokhosteen, Arman; Soltani, M.; Barabadi, Banafsheh20192019, vol.141, no.1
Study on Heat Transfer and Corrosion Resistance of Anodized Aluminum Alloy in Gallium-Based Liquid MetalCui, Yuntao; Ding, Yujie; Xu, Shuo; Wang, Yushu; Rao, Wei; Liu, Jing20192019, vol.141, no.1
Liquid Cooling of Compute SystemGullbrand, Jessica; Luckeroth, Mark J.; Sprenger, Mark E.; Winkel, Casey20192019, vol.141, no.1
Structural Design of Land Grid Array Loading Mechanisms for Intel Central Processor Unit Stack RetentionGeng, Phil20192019, vol.141, no.1
Special Section of Review Articles From Intel CorporationYang, Jin20192019, vol.141, no.1
Swing Touch Risk Assessment of Bonding Wires in High-Density Package Under Mechanical Shock ConditionFu, Guicui; Wan, Bo; Jiang, Maogong; Li, Yanruoyue; Ma, Cheng20192019, vol.141, no.1
Study on BEOL Failures in a Chip by Shear Tests of Copper Pillar BumpsWang, Lei; Wang, Jun; Xiao, Fei20192019, vol.141, no.1
Thermomechanical Interaction Between Thin Bare-Die Package and Thermal Solution in Next-Generation Mobile Computing PlatformsUppal, Aastha; Peterson, Jerrod; Chang, Je-Young; Guo, Xi; Liang, Frank; Tang, Weihua20192019, vol.141, no.1
Mechanical Characterization of Thermal Interface Materials and Its ChallengesSubramanian, Vijay; Sanchez, Jorge; Bautista, Joseph; He, Yi; Wang, Jinlin; Das, Abhishek; Schuldes, Jesus Gerardo Reyes; Yazzie, Kyle; Dhavaleswarapu, Hemanth K.; Malatkar, Pramod20192019, vol.141, no.1
Characterization of Hybrid Wicking Structures for Flexible Vapor ChambersMcNally, Dylan P.; Lewis, Ryan; Lee, Y. C.20192019, vol.141, no.1



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