期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2023



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2019, vol.141, no.1 2019, vol.141, no.2 2019, vol.141, no.3 2019, vol.141, no.4

题名作者出版年年卷期
Simultaneous Optimization of an Array of Heat SinksKaramanis, Georgios; Hodes, Marc20192019, vol.141, no.2
Study on the Die-Attach Voids Distribution With X-Ray and Image Processing TechniquesSesek, Aleksander; Chambers, Olga; Trontelj, Janez20192019, vol.141, no.2
Phenomenological Modeling of Carpeted Surface for Drop Simulation of Portable ElectronicsSirimamilla, Abhi; Ye, Hua; Wu, Yinan20192019, vol.141, no.2
Thermal Management and Characterization of High-Power Wide-Bandgap Semiconductor Electronic and Photonic Devices in Automotive ApplicationsOh, Seung Kyu; Lundh, James Spencer; Shervin, Shahab; Chatterjee, Bikramjit; Lee, Dong Kyu; Choi, Sukwon; Kwak, Joon Seop; Ryou, Jae-Hyun20192019, vol.141, no.2
New Electronic Packaging Method for Potted Guidance Electronics to Sustain Temperature Cycling and Survive High-G ApplicationsChao, N. H.; Carlucci, D. E.20192019, vol.141, no.2
Prediction of Electromigration Critical Current Density in Passivated Arbitrary-Configuration InterconnectKimura, Yasuhiro; Saka, Masumi20192019, vol.141, no.2
Design of Thermal Ground Planes for Cooling of Foldable SmartphonesNematollahisarvestani, Ali; Lewis, Ryan J.; Lee, Yung-Cheng20192019, vol.141, no.2
Experimental SAC305 Shear Stress-Strain Hysteresis Loop Construction Using Hall's One-Dimensional Model Based on Strain Gages MeasurementsLibot, J. -B.; Alexis, J.; Dalverny, O.; Arnaud, L.; Milesi, P.; Dulondel, F.20192019, vol.141, no.2
Numerical Study on Mitigation of Flow Maldistribution in Parallel Microchannel Heat Sink: Channels Variable Width Versus Variable Height ApproachKumar, Ritunesh; Singh, Gurjeet; Mikielewicz, Dariusz20192019, vol.141, no.2
Reliability Considerations for Oil Immersion-Cooled Data CentersShah, Jimil M.; Eiland, Richard; Rajmane, Pavan; Siddarth, Ashwin; Agonafer, Dereje; Mulay, Veerendra20192019, vol.141, no.2



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