期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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2019, vol.141, no.1 2019, vol.141, no.2 2019, vol.141, no.3 2019, vol.141, no.4

题名作者出版年年卷期
Cylindrical Tuber Encapsulant Layer Realization by Patterned Surface for Chip-on-Board Light-Emitting Diodes PackagingYu, Xingjian; Hu, Run; Wu, Ruikang; Xie, Bin; Zhang, Xiaoyu; Luo, Xiaobing20192019, vol.141, no.3
Evaporative Wicking Phenomena on Nanotextured SurfacesDuong Vy Le; Pham, Quang N.; Lee, Jonggyu; Zhang, Shiwei; Won, Yoonjin20192019, vol.141, no.3
Thermal-Hydraulic Performance and Optimization of Tube Ellipticity in a Plate Fin-And-Tube Heat ExchangerZhu, Hua; Yang, Zhuo; Khan, Tariq Amin; Li, Wei; Sun, Zhijian; Du, Jincai; Zhang, Zhengjiang; Zhou, Jianxin20192019, vol.141, no.3
Reduced Working Temperature of Quantum Dots-Light-Emitting Diodes Optimized by Quantum Dots at Silica-on-Chip StructureXie, Bin; Liu, Haochen; Sun, Xiao Wei; Yu, Xingjian; Wu, Ruikang; Wang, Kai; Luo, Xiaobing20192019, vol.141, no.3
Orientation Effects in Two-Phase Microgap FlowRobinson, Franklin L.; Bar-Cohen, Avram20192019, vol.141, no.3
Advanced Characterization Techniques and Analysis of Thermal Properties of AlGaN/GaN Multifinger Power HEMTs on SiC Substrate Supported by Three-Dimensional SimulationMarek, Juraj; Cernaj, L'ubos; Donoval, Daniel; Kovac, Jaroslav; Dua, Christian; Delage, Sylvain L.; Jacquet, Jean-Claude; Chvala, Ales; Szobolovszky, Robert; Kovac, Jaroslav, Jr.; Florovic, Martin20192019, vol.141, no.3
Enhanced Sintered Silver for SiC Wide Bandgap Power Electronics Integrated Package ModuleLu, Mei-Chien20192019, vol.141, no.3
Dynamic Load Balancing Using Actual Workload Traces Based on Central Processing Unit TemperaturesNakajo, Yusuke; Athavale, Jayati; Yoda, Minami; Joshi, Yogendra; Nishi, Hiroaki20192019, vol.141, no.3
Special Issue on InterPACK 2018Dede, Ercan M.; Boteler, Lauren; Chen, Changqing; Gromala, Przemyslaw Jakub; Leever, Benjamin; Li, Wei20192019, vol.141, no.3
Impact of Server Thermal Design on the Cooling Efficiency: Chassis DesignKhalili, Sadegh; Alissa, Husam; Nemati, Kourosh; Seymour, Mark; Curtis, Robert; Moss, David; Sammakia, Bahgat20192019, vol.141, no.3
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