期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024

2020, vol.32, no.1 2020, vol.32, no.2 2020, vol.32, no.3 2020, vol.32, no.4

题名作者出版年年卷期
Feasibility investigation and characterization of low-pressure-assisted sintered-silver bonded large-area DBA platesYansong Tan; Xin Li; Xu Chen; Zhenwen Yang; Guo-Quan Lu20202020, vol.32, no.3
Chromium effects on the microstructural, mechanical and thermal properties of a rapidly solidified eutectic Sn-Ag alloySanaa Razzaq Abbas; Mohammed S. Gumaan; Rizk Mostafa Shalaby20202020, vol.32, no.3
Effect of hourglass shape solder joints on underfill encapsulation process: numerical and experimental studiesMuhammad Naqib Nashrudin; Zhong Li Gan; Aizat Abas; M. H. H. Ishak; M. Yusuf Tura Ali20202020, vol.32, no.3
Effect of flux functional group for solder paste formulation towards soldering quality of SAC305/CNT/CuNorliza Ismail; Azman Falar; Maria Abu Bakar; Roslina Ismail; Najib Saedi Ibrahim20202020, vol.32, no.3
SMT assembly effects on organic substrate lifetime reductionSeok-Hwan Huh20202020, vol.32, no.3
Prediction of viscosity of ternary tin-based lead-free solder melt using BP neural networkMin Wu; Bailin Lv20202020, vol.32, no.3
Experimental and numerical fatigue life assessment of SAC305 solders subjected to combined temperature and harmonic vibration loadingsMohammad Gharaibeh20202020, vol.32, no.3



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