期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024

2020, vol.32, no.1 2020, vol.32, no.2 2020, vol.32, no.3 2020, vol.32, no.4

题名作者出版年年卷期
Selective etching and hardness properties of quenched SAC305 solder jointsKheawhom, Soorathep; Illes, Balazs; Mohd Nazeri, Muhammad Firdaus; Mohamad, Ahmad Azmin; Salleh, Nor Azmira; Yahaya, Muhamad Zamri20202020, vol.32, no.4
Low-voiding solder pastes in LED assemblyDziurdzia, Barbara; Sobolewski, Maciej; Mikolajek, Janusz; Wronski, Sebastian20202020, vol.32, no.4
Impact of convection on thermographic analysis of silver based thermal jointsStojek, Krzysztof Jakub; Felba, Jan; Nicolics, Johann; Wolczynski, Dominik20202020, vol.32, no.4
Numerical investigation on the effect of solder paste rheological behaviour and printing speed on stencil printingKrammer, Oliver; Al-Ma'aiteh, Tareq, I; Illes, Balazs; Busek, David; Dusek, Karel20202020, vol.32, no.4
Structural characterization of inkjet printed capacitor layers in various technological conditionsKiliszkiewicz, Milena; Przybylski, Dariusz; Felba, Jan; Korbutowicz, Ryszard20202020, vol.32, no.4
IMAPS 2019 PolandSkwarek, Agata20202020, vol.32, no.4
The influence of soldering process parameters on the optical and thermal properties of power LEDsPtak, Przemyslaw; Gorecki, Krzysztof; Skwarek, Agata; Witek, Krzysztof; Tarasiuk, Jacek20202020, vol.32, no.4
Effect of different thermocouple constructions on heat-level vapour phase soldering profilesAlaya, Mohamed Amine; Megyeri, Viktoria; Busek, David; Harsanyi, Gabor; Geczy, Attila20202020, vol.32, no.4
Heat transfer aspects of condensation during vapour phase soldering on aligned PCB-based surfacesStraubinger, Daniel; Bozsoki, Istvan; Illes, Balazs; Krammer, Oliver; Busek, David; Geczy, Attila20202020, vol.32, no.4



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