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期刊
ISSN
1043-7398
刊名
Journal of Electronic Packaging
参考译名
电子封装杂志；美国机械工程师学会汇刊
收藏年代
1995～2024
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2020, vol.142, no.1
2020, vol.142, no.2
2020, vol.142, no.3
2020, vol.142, no.4
题名
作者
出版年
年卷期
An Experimental Investigation on the Fluid Distribution in a Two-Phase Cooled Rack Under Steady and Transient Information Technology Loads
Khalili, Sadegh; Rangarajan, Srikanth; Gektin, Vadim; Alissa, Husam; Sammakia, Bahgat
2020
2020, vol.142, no.4
Electro-Thermal Codesign Methodology of an On-Board Electric Vehicle Charger
Tayyara, Omri; Silva, Carlos Da; Nasr, Miad; Assadi, Amir; Gupta, Kshitij; Trescases, Olivier; Amon, Cristina H.
2020
2020, vol.142, no.4
Experimental Study of Flexible Electrohydrodynamic Conduction Pumping for Electronics Cooling
Christidis, Pavolas N.; Vayas Tobar, Nicolas; Talmor, Michal; Yagoobi, Jamal; Castaneda, Alexander J.; O'Connor, Nathaniel J.
2020
2020, vol.142, no.4
Additive Manufactured Impinging Coolant, Low Electromagnetic Interference, and Nonmetallic Heat Spreader: Design and Optimization
Whitt, Reece; Huitink, David; Yuan, Zhao; Emon, Asif; Luo, Fang; Hudson, Skyler
2020
2020, vol.142, no.4
Minimizing Temperature Nonuniformity by Optimal Arrangement of Hotspots in Vertically Stacked Three-Dimensional Integrated Circuits
Rangarajan, Srikanth; Hadad, Yaser; Choobineh, Leila; Sammakia, Bahgat
2020
2020, vol.142, no.4
Fatigue Life of Sn3.0Ag0.5Cu Solder Alloy Under Combined Cyclic Shear and Constant Tensile/Compressive Loads
Dale, Travis; Singh, Yuvraj; Bernander, Ian; Subbarayan, Ganesh; Handwerker, Carol; Su, Peng; Glasauer, Bernard
2020
2020, vol.142, no.4
A System to Package Perspective on Transient Thermal Management of Electronics
de Bock, H. Peter; Huitink, David; Shamberger, Patrick; Lundh, James Spencer; Choi, Sukwon; Niedbalski, Nicholas; Boteler, Lauren
2020
2020, vol.142, no.4
The Doping Dependence of the Thermal Conductivity of Bulk Gallium Nitride Substrates
Song, Yiwen; Lundh, James Spencer; Wang, Weijie; Leach, Jacob H.; Eichfeld, Devon; Krishnan, Anusha; Perez, Carlos; Ji, Dong; Borman, Trent; Ferri, Kevin; Maria, Jon-Paul; Chowdhury, Srabanti; Foley, Brian M.; Choi, Sukwon; Ryou, Jae-Hyun
2020
2020, vol.142, no.4
System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities Using Phase-Change Materials
Nafis, Bakhtiyar Mohammad; Iradukunda, Ange-Christian; Huitink, David
2020
2020, vol.142, no.4
Acceleration Factor Modeling of Flexible Electronic Substrates From Actual Human Body Measurements
Lall, Pradeep; Yadav, Vikas; Narangaparambil, Jinesh; Liu, Wei; Thomas, Tony
2020
2020, vol.142, no.4
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