期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024

2021, vol.33, no.1 2021, vol.33, no.2 2021, vol.33, no.3 2021, vol.33, no.4 2021, vol.33, no.5

题名作者出版年年卷期
Detection of solder paste defects with an optimization-based deep learning model using image processing techniquesSezer, Au; Altan, Aytac20212021, vol.33, no.5
Surface energetic-based analytical filling time model for flip-chip underfill processNg, Fei Chong; Abas, Mohamad Aizat20212021, vol.33, no.5
Simulation of jet printing of solder paste for surface mounted technologyMartensson, Gustaf Eric; Gohl, Johan; Mark, Andreas20212021, vol.33, no.5
Microstructure evolution and shear strength of full Cu3Sn- microporous copper composite joint by thermo-compression bondingSun, F.; Pan, Zhen; Liu, Yang; Li, Xiang; Liu, Haoyu; Li, Wenpeng20212021, vol.33, no.5
Impact of thermal interface material on luminous flux curve of InGaAlP low-power light-emitting diodesRaypah, Muna E.; Devarajan, Mutharasu; Mahmud, Shahrom20212021, vol.33, no.5
Reliability analysis of SnAgCu lead-free solder thermal interface materials in microelectronicsEkpu, Mathias20212021, vol.33, no.5
Role of aging temperature on thermomechanical fatigue lifetime of solder joints in electronic systemsSiswanto, Waluyo Adi; Borodin, Kirill; Mahmoud, Zaid Hamid; Surendar, A.; Sajjadifar, Sami; Abdilova, Galiya; Chang, Jun20212021, vol.33, no.4
Interfacial reaction between Ni particle reinforcements and liquid Sn-based eutectic soldersLin, Chung-Yung20212021, vol.33, no.4
Influence of ultrasounds on interfacial microstructures of Cu-Sn solder jointsHan, Xu; Li, Xiaoyan; Yao, Peng; Chen, Dalong20212021, vol.33, no.4
Effect of Zn-powder content on the property of Cu/SAC0307 powder/Cu joint under ultrasonic assisted at low temperatureGan, Gui-sheng; Jiang, Liujie; Chen, Shiqi; Deng, Yongqiang; Yang, Donghua; Jiang, Zhaoqi; Tian, Mizhe; Xu, Qianzhu; Liu, Xin; Cao, Huadong20212021, vol.33, no.4
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