期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024

2021, vol.33, no.1 2021, vol.33, no.2 2021, vol.33, no.3 2021, vol.33, no.4 2021, vol.33, no.5

题名作者出版年年卷期
Cleaning control of stencil printing subject to performance deteriorationXi, Rui; Yu, Jiangyou; Cao, Le; Zheng, Xiaojiang; Guo, Jun20212021, vol.33, no.3
Effect of Sb additions on the creep behaviour of low temperature lead-free Sn-8Zn-3Bi solder alloyRen, Guang; Collins, Maurice20212021, vol.33, no.3
Thermal-mechanical reliability analysis of WLP with fine-pitch copper post bumpsSun, Haiyan; Gao, Bo; Zhao, Jicong20212021, vol.33, no.3
An investigation on mechanical random vibration fatigue damage of solder joints in electronic systemsWang, Feng; Zhang, Fangfang; Huang, Qixiang; Salmani, Mohammad20212021, vol.33, no.3
Useful lifetime estimation of solder joints in power semiconductors employed in current source and voltage source invertersZou, Hao; Xie, Fang; Du, Bo; Kavithaa, G.20212021, vol.33, no.3
Thermomechanical fatigue lifetime evaluation of solder joints in power semiconductors using a novel energy based modelingZhang, Buen; Jabarullah, Noor H.; Alkaim, Ayad F.; Danshina, Svetlana; Krasnopevtseva, Irina V.; Zheng, Yuan; Geetha, Nisith20212021, vol.33, no.3



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