期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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2021, vol.143, no.1 2021, vol.143, no.2 2021, vol.143, no.3 2021, vol.143, no.4

题名作者出版年年卷期
Parametric Effects of Heater Size, Contact Angle, and Surrounding Vessel Size on Pool Boiling Critical Heat Flux From Horizontal SurfacesShe, Zhenyu; Dhir, Vijay K.20212021, vol.143, no.4
Microflow-Enhanced Bubble Dynamics Along With Gradient Porous SurfacesLin, Cheng-Hui; Won, Yoonjin20212021, vol.143, no.4
Boiling Enhanced Lidded Server Packages for Two-Phase Immersion Cooling Using Three-Dimensional Metal Printing and Metal Injection Molding TechnologiesChuang, Jimmy; Yang, Jin; Shia, David; Li, Y. L.20212021, vol.143, no.4
Experimental Study and Mitigation of Pressure Drop Oscillation Using Active ControlJin, Qi; Wen, John T.; Narayanan, Shankar20212021, vol.143, no.4
Viability of Cryogenic Cooling to Reduce Processor Power ConsumptionNordlund, Alec; Harrison, Matthew; Gess, Joshua20212021, vol.143, no.4
The Effect of Uneven Heating on the Flow Distribution Between Parallel Microchannels Undergoing BoilingMiglani, Ankur; Soto, Anali; Weibel, Justin A.; Garimella, Suresh, V20212021, vol.143, no.4
Peak Temperature Mitigation of a Multimicrochannel Evaporator Under Transient Heat LoadsAnderson, Caleb; Richey, Joshua; Fish, Michael; Bandhauer, Todd20212021, vol.143, no.4
Guidelines for Designing Micropillar Structures for Enhanced Evaporative Heat TransferGuye, Kidus; Dong, De; Kim, Yunseo; Lee, Hyoungsoon; Dogruoz, Baris; Agonafer, Damena20212021, vol.143, no.4
Special Issue Dedicated to Professor Avram Bar-CohenWarzoha, Ronald J.; Sharar, Darin J.; Amalfi, Raffaele Luca; Tay, Andrew20212021, vol.143, no.4
Reduced Order Design Optimization of Liquid Cooled Heat SinksLad, Aniket Ajay; James, Kai A.; King, William P.; Miljkovic, Nenad20212021, vol.143, no.4
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