期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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2021, vol.143, no.1 2021, vol.143, no.2 2021, vol.143, no.3 2021, vol.143, no.4

题名作者出版年年卷期
Modular Heat Sinks for Enhanced Thermal Management of ElectronicsHoque, Muhammad Jahidul; Gunay, Alperen; Stillwell, Andrew; Gurumukhi, Yashraj; Miljkovic, Nenad; Pilawa-Podgurski, Robert C. N.20212021, vol.143, no.2
Scattering Nanoparticles-Induced Reflection Effect for Enhancing Optical Efficiency of Inverted Quantum Dots-Light-Emitting Diodes Combined With the Centrifugation TechniqueLi, Zong-Tao; Liang, Jia-Yong; Li, Jia-Sheng; Li, Jie-Xin; Tang, Yong20212021, vol.143, no.2
Special Section on Nanoscale/Microscale Energy Transport, Conversion and Storage in Electronics PackagingWarzoha, Ronald J.20212021, vol.143, no.2
Applications and Impacts of Nanoscale Thermal Transport in Electronics PackagingWarzoha, Ronald J.; Wilson, Adam A.; Donovan, Brian F.; Donmezer, Nazli; Giri, Ashutosh; Hopkins, Patrick E.; Choi, Sukwon; Pahinkar, Darshan; Shi, Jingjing; Graham, Samuel20212021, vol.143, no.2
Reliability Evaluation of Flexible Hybrid Electronics Systems Considering Degradation Behavior Under Multistress Operating ConditionsDavila-Frias, Alex; Limon, Shah; Marinov, Val; Yadav, Om Prakash20212021, vol.143, no.2
Detection of Unusual Thermal Activities in a Semiconductor Chip Using Backside Infrared Thermal ImagingSalvi, Swapnil S.; Jain, Ankur20212021, vol.143, no.2
Aging and Fatigue of Aerosol Jet-Printed Nano-Ag Traces on Flexible SubstrateBorgesen, Peter; Raj, Arun; Sivasubramony, Rajesh Sharma; Yadav, Manu; Thekkut, Sanoop; Khinda, Gurvinder Singh; Alhendi, Mohammed; Poliks, Mark D.20212021, vol.143, no.2
Evolution of Anand Parameters With Elevated Temperature Aging for SnAgCu Lead-free AlloysLall, Pradeep; Yadav, Vikas; Suhling, Jeff; Locker, David20212021, vol.143, no.2
Experimental Characterization of Two-Phase Cold Plates Intended for High-Density Data Center Servers Using a Dielectric FluidRamakrishnan, Bharath; Cong Hiep Hoang; Khalili, Sadegh; Hadad, Yaser; Rangarajan, Srikanth; Pattamatta, Arvind; Sammakia, Bahgat20212021, vol.143, no.2
Study of a Lab-Scale Organic Rankine Cycle for the Ultra-Low-Temperature Waste Heat Recovery Associated With Data CentersAraya, Sebastian; Wemhoff, Aaron P.; Jones, Gerard F.; Fleischer, Amy S.20212021, vol.143, no.2
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