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期刊
ISSN
1043-7398
刊名
Journal of Electronic Packaging
参考译名
电子封装杂志;美国机械工程师学会汇刊
收藏年代
1995~2024
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2021, vol.143, no.1
2021, vol.143, no.2
2021, vol.143, no.3
2021, vol.143, no.4
题名
作者
出版年
年卷期
Heat Transfer Enhancement Through Array Jet Impingement on Strategically Placed High Porosity High Pore-Density Thin Copper Foams
Rajamuthu, Varun Prasanna; Panse, Sanskar S.; Ekkad, Srinath
2021
2021, vol.143, no.3
Flow-Controlled Spray Cooling Approaches for Dynamic Thermal Management
Bostanci, Huseyin; Yata, Vishnu V. R.; Kaluvan, Suresh
2021
2021, vol.143, no.3
Compact Transient Thermal Model of Microfluidically Cooled Three-Dimensional Stacked Chips With Pin-Fin Enhanced Microgap
Hu, Yuanchen; Hossen, Md Obaidul; Wan, Zhimin; Bakir, Muhannad S.; Joshi, Yogendra
2021
2021, vol.143, no.3
Influence of Carbon Nanoparticles Additives on Nanosilver Joints in LTJT Technology
Szalapak, Jerzy; Kielbasinski, Konrad; Dybowska-Sarapuk, Lucja; Krzeminski, Jakub; Teodorczyk, Marian; Kowaluk, Tomasz; Jakubowska, Malgorzata
2021
2021, vol.143, no.3
Influences of Small Jet-to-Wall Spacings on Heat Transfer Characteristics and Flow-Field Entrainment Effects of Microscale Jets
Subrahmanyam, Prabhakar; Gnanavel, B. K.
2021
2021, vol.143, no.3
Experimental Characterization of Two-Phase Cooling of Power Electronics in Thermosiphon and Forced Convection Modes
Battaglia, Fabio; Singer, Farah; Deisenroth, David C.; Ohadi, Michael M.
2021
2021, vol.143, no.3
A Review of Thermo-Hydraulic Performance of Metal Foam and Its Application as Heat Sinks for Electronics Cooling
Gong, Liang; Xu, Minghai; Joshi, Yogendra; Li, Yongtong
2021
2021, vol.143, no.3
Design, Fabrication, and Testing of a Novel Design for Flexible Light-Emitting Diode Signage Modules
Adhikari, Ram C.; Beyragh, Dawood S.; Pahlevani, Majid
2021
2021, vol.143, no.3
Design and Optimization of Control Strategy to Reduce Pumping Power in Dynamic Liquid Cooling
Kasukurthy, Rajesh; Rachakonda, Amruthavalli; Agonafer, Dereje
2021
2021, vol.143, no.3
Study of Different Dispensing Patterns of No-Flow Underfill Using Numerical and Experimental Methods
Ali, M. Yusuf Tura; Samsudin, Z.; Nashrudin, Muhammad Naqib; Abas, Aizat; Abdullah, M. Z.
2021
2021, vol.143, no.3
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