期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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2021, vol.143, no.1 2021, vol.143, no.2 2021, vol.143, no.3 2021, vol.143, no.4

题名作者出版年年卷期
Machine Learning-Based Predictions of Benefits of High Thermal Conductivity Encapsulation Materials for Power Electronics PackagingAcharya, Palash, V; Lokanathan, Manojkumar; Ouroua, Abdelhamid; Hebner, Robert; Strank, Shannon; Bahadur, Vaibhav20212021, vol.143, no.4
Experimental Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of ElectronicsGhaffari, Omidreza; Tong, Wei; Larimi, Yaser Nabavi; al Sayed, Chady; Genieli, Alireza; Morissette, Jean-Francois; Grenier, Francis; Jasmin, Simon; Frechette, Luc; Sylvestre, Julien20212021, vol.143, no.4
Experimental Analysis and Modeling of a Novel Thermosyphon System for Electronics CoolingCataldo, Filippo; Crea, Yuri Carmelo20212021, vol.143, no.4
Effect of Phase Change Material on Dynamic Thermal Management Performance for Power Electronics PackagesHollis, Justin; Sharar, Darin J.; Bandhauer, Todd20212021, vol.143, no.4
Reduced Order Design Optimization of Liquid Cooled Heat SinksLad, Aniket Ajay; James, Kai A.; King, William P.; Miljkovic, Nenad20212021, vol.143, no.4
Special Issue Dedicated to Professor Avram Bar-CohenWarzoha, Ronald J.; Sharar, Darin J.; Amalfi, Raffaele Luca; Tay, Andrew20212021, vol.143, no.4
Guidelines for Designing Micropillar Structures for Enhanced Evaporative Heat TransferGuye, Kidus; Dong, De; Kim, Yunseo; Lee, Hyoungsoon; Dogruoz, Baris; Agonafer, Damena20212021, vol.143, no.4
Peak Temperature Mitigation of a Multimicrochannel Evaporator Under Transient Heat LoadsAnderson, Caleb; Richey, Joshua; Fish, Michael; Bandhauer, Todd20212021, vol.143, no.4
The Effect of Uneven Heating on the Flow Distribution Between Parallel Microchannels Undergoing BoilingMiglani, Ankur; Soto, Anali; Weibel, Justin A.; Garimella, Suresh, V20212021, vol.143, no.4
Viability of Cryogenic Cooling to Reduce Processor Power ConsumptionNordlund, Alec; Harrison, Matthew; Gess, Joshua20212021, vol.143, no.4
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