期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024

2022, vol.34, no.1 2022, vol.34, no.2 2022, vol.34, no.3 2022, vol.34, no.4 2022, vol.34, no.5

题名作者出版年年卷期
An intelligent system for reflow oven temperature settings based on hybrid physics-machine learning modelLai, Yangyang; Pan, Ke; Cen, Yuqiao; Yang, Junbo; Cai, Chongyang; Yin, Pengcheng; Park, Seungbae20222022, vol.34, no.5
Predictive model of the solder paste stencil printing process by response surface methodologyChen, Chun-Sheng; Wang, Hai; Kao, Yung-Chin; Lu, Po-Jen; Chen, Wei-Ren20222022, vol.34, no.5
Effect of Cu, Ni, Ag addition on creeping properties of Sn5Sb-0.5Cu-0.1Ni-0.5Ag for high temperature packagingHan, Bangyao; Sun, Fenglian; Zhang, Chi; Wang, Xinlei20222022, vol.34, no.5
Effects of alloying element on mechanical properties of Sn-Bi solder alloys: a reviewKamaruzzaman, Lina Syazwana; Goh, Yingxin20222022, vol.34, no.5
Development of holmium doped eutectic Sn-Ag lead-free solder for electronic packagingShalaby, Rizk Mostafa20222022, vol.34, no.5
Mechanical, photoelectric and thermal reliability of SAC307 solder joints with Ni-decorated MWCNTs for flip-chip LED package component during agingChen, Yue; Zhai, Xinmeng; Li, Yuefeng; Zou, Jun; Shi, Mingming; Yang, Bobo20222022, vol.34, no.5
Study of mechanical properties of indium-based solder alloys for cryogenic applicationsDeshpande, Madhuri Chandrashekhar; Chaudhari, Rajesh; Narayanan, Ramesh; Kale, Harishwar20222022, vol.34, no.4
Investigation of solder beading phenomenon under surface-mounted electrolytic capacitorsStraubinger, Daniel; Toth, Attila; Kerek, Viktor; Czeczei, Zsolt; Szabo, Andras; Geczy, Attila20222022, vol.34, no.4
The influence of SACX0307-ZnO nanocomposite solder alloys on the optical and thermal properties of power LEDsSkwarek, Agata; Ptak, Przemyslaw Piotr; Gorecki, Krzysztof; Witek, Krzysztof; Illes, Balazs20222022, vol.34, no.4
Solder void size reduction in semiconductor package by vacuum reflow and pressure cure processesYeo, Siang Miang; Yow, Ho Kwang; Yeoh, Keat Hoe20222022, vol.34, no.4
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