期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024

2022, vol.34, no.1 2022, vol.34, no.2 2022, vol.34, no.3 2022, vol.34, no.4 2022, vol.34, no.5

题名作者出版年年卷期
Influence of the soldering paste type on optical and thermal parameters of LED modulesGorecki, Krzysztof; Ptak, Przemyslaw; Dziurdzia, Barbara20222022, vol.34, no.4
Analytical and numerical analyses of filling progression and void formation in flip-chip underfill encapsulation processNg, Fei Chong; Abas, Aizat; Nashrudin, Muhammad Naqib; Tura Ali, M. Yusuf20222022, vol.34, no.4
Solder void size reduction in semiconductor package by vacuum reflow and pressure cure processesYeo, Siang Miang; Yow, Ho Kwang; Yeoh, Keat Hoe20222022, vol.34, no.4
The influence of SACX0307-ZnO nanocomposite solder alloys on the optical and thermal properties of power LEDsSkwarek, Agata; Ptak, Przemyslaw Piotr; Gorecki, Krzysztof; Witek, Krzysztof; Illes, Balazs20222022, vol.34, no.4
Investigation of solder beading phenomenon under surface-mounted electrolytic capacitorsStraubinger, Daniel; Toth, Attila; Kerek, Viktor; Czeczei, Zsolt; Szabo, Andras; Geczy, Attila20222022, vol.34, no.4
Study of mechanical properties of indium-based solder alloys for cryogenic applicationsDeshpande, Madhuri Chandrashekhar; Chaudhari, Rajesh; Narayanan, Ramesh; Kale, Harishwar20222022, vol.34, no.4



制造业外文文献服务平台