期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



全部

1995 1996 1997 1998 1999 2000
2001 2002 2003 2004 2005 2006
2007 2008 2009 2010 2011 2012
2013 2014 2015 2016 2017 2018
2019 2020 2021 2022 2023 2024

2022, vol.144, no.1 2022, vol.144, no.2 2022, vol.144, no.3 2022, vol.144, no.4

题名作者出版年年卷期
Optimized Design of Various Ag Decorated Sn-xAg-Cu-0.7 Solder Bump on Cycling Fatigue Reliability for Wafer-Level Chip Scale PackagingLee, H. T.; Ho, C. Y.; Lee, C. C.20222022, vol.144, no.4
Coupled Calculations of Data Center Cooling and Power Distribution SystemsWemhoff, Aaron P.; Ahmed, Faisal20222022, vol.144, no.4
Simultaneous Measurement of Temperature and Strain in Electronic Packages Using Multiframe Super-Resolution Infrared Thermography and Digital Image CorrelationLyons, Sara K.; Chandramohan, Aditya; Weibel, Justin A.; Garimella, Suresh, V20222022, vol.144, no.4
Electrical Reliability of Flexible Silicon Package Integrated on Polymer Substrate During Repeated Bending DeformationsKim, Tae-Wook; Kim, Jae-Min; Yun, Hyeon-Ji; Lee, Jong-Sung; Lee, Jae-Hak; Song, Jun-Yeob; Joo, Young-Chang; Lee, Won-Jun; Kim, Byoung-Joon20222022, vol.144, no.4
Fracture Behavior and Reliability of Low-Silver Lead-Free Solder JointsSharma, Ved Prakash; Datla, Naresh Varma20222022, vol.144, no.4
Influence of Laser Soldering Temperatures on Through-Hole ComponentZahiri, Saifulmajdy A.; Abas, Aizat; Sharif, M. F. M.; Ani, Fakhrozi Che20222022, vol.144, no.4
A Surface Energy Approach to Developing an Analytical Model for the Underfill Flow Process in Flip-Chip PackagingYao, Xingjun; Jiang, Weijie; Yang, Jiahui; Fang, Junjie; Zhang, Wenjun20222022, vol.144, no.4
Numerical and Parametric Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of ElectronicsTong, Wei; Ganjali, Alireza; Ghaffari, Omidreza; al Sayed, Chady; Frechette, Luc; Sylvestre, Julien20222022, vol.144, no.4
A Novel Design of Rack Mount Server Thermal Simulator: Design, Assembly, and Experimental VerificationMohsenian, Ghazal; Hoang, Cong Hiep; Nemati, Kourosh; Alissa, Hussam; Tradat, Mohammad; Fallahtafti, Najmeh; Radmard, Vahideh; Murray, Bruce; Sammakia, Bahgat20222022, vol.144, no.4
Parametric Effects on Pool Boiling Heat Transfer and Critical Heat Flux: A Critical ReviewEmir, Tolga; Ourabi, Hamza; Budakli, Mete; Arik, Mehmet20222022, vol.144, no.4
12345678



制造业外文文献服务平台