期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



全部

1995 1996 1997 1998 1999 2000
2001 2002 2003 2004 2005 2006
2007 2008 2009 2010 2011 2012
2013 2014 2015 2016 2017 2018
2019 2020 2021 2022 2023 2024

2022, vol.144, no.1 2022, vol.144, no.2 2022, vol.144, no.3 2022, vol.144, no.4

题名作者出版年年卷期
Advancement of Chip Stacking Architectures and Interconnect Technologies for Image SensorsLu, Mei-Chien20222022, vol.144, no.2
Evaluating the Reliability of Passive Server Components for Single-Phase Immersion CoolingShah, Jimil M.; Padmanaban, Keerthivasan; Singh, Hrishabh; Asokan, Surya Duraisamy; Saini, Satyam; Agonafer, Dereje20222022, vol.144, no.2
Process-Recipe Development for Printing of Multilayer Circuitry With Z-Axis Interconnects Using Aerosol-Jet Printed Dielectric ViasLall, Pradeep; Narangaparambil, Jinesh; Soni, Ved; Miller, Scott20222022, vol.144, no.2
High Strain Rate Mechanical Properties of SAC-Q Solder for Extreme Temperatures After Exposure to Isothermal Aging Up to 90 DaysLall, Pradeep; Mehta, Vishal; Suhling, Jeff; Blecker, Ken20222022, vol.144, no.2
Liquid-Cooled Heat Sink Optimization for Thermal Imbalance Mitigation in Wide-Bandgap Power ModulesSahu, Raj; Gurpinar, Emre; Ozpineci, Burak20222022, vol.144, no.2
A Novel Package-Integrated Cyclone Cooler for the Thermal Management of Power ElectronicsMiorini, Rinaldo; Sharar, Darin; Gowda, Arun; Hoel, Cathleen; Whalen, Bryan; de Bock, Peter20222022, vol.144, no.2
Multilayer Conductive Metallization With Offset Vias Using Aerosol Jet TechnologyLall, Pradeep; Goyal, Kartik; Miller, Scott20222022, vol.144, no.2
Special Issue on InterPACK2020Yang, Jin; Choi, Sukwon; Lee, Jaeho; Karajgikar, Saket20222022, vol.144, no.2
Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data CentersAmalfi, Raffaele L.; Salamon, Todd; Cataldo, Filippo; Marcinichen, Jackson B.; Thome, John R.20222022, vol.144, no.2
Figure of Merit-Based Optimization Approach of Phase Change Material-Based Composites for Portable Electronics Using Simplified ModelSingh, Ayushman; Rangarajan, Srikanth; Choobineh, Leila; Sammakia, Bahgat20222022, vol.144, no.2
123



制造业外文文献服务平台