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期刊
ISSN
1043-7398
刊名
Journal of Electronic Packaging
参考译名
电子封装杂志;美国机械工程师学会汇刊
收藏年代
1995~2024
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2022, vol.144, no.1
2022, vol.144, no.2
2022, vol.144, no.3
2022, vol.144, no.4
题名
作者
出版年
年卷期
Analytical Multi-Parametric Design Optimization for the Miniaturization of Flip-Chip Package
Ng, Fei Chong; Abas, Mohamad Aizat
2022
2022, vol.144, no.4
Design and Fabrication of Leadless Package Structure for Pressure Sensors
Tian, Junwang; Jin, Zhong; Tang, Xin; Peng, Wenxian; Liu, Junfu; Liu, Yunpeng; Chen, Taotao; Xiao, Jinqing; Li, Junhui
2022
2022, vol.144, no.4
Prediction of Board Level Pad Cratering Strength With the Predefined Failure Criteria From Joint Level Testing
Zhang, Qiming; Lee, S. W. Ricky
2022
2022, vol.144, no.4
Joint Analysis and Reliability Test of Epoxy-Based Nano Silver Paste Under Different Pressure-Less Sintering Processes
Wang, Xinyue; Zeng, Zejun; Zhang, Guoqi; Zhang, Jing; Liu, Pan
2022
2022, vol.144, no.4
Effect of Wavy Wall and Plate Bifurcations on Heat Transfer Enhancement in Microchannel
Kumar, D. Sathish; Jayavel, S.
2022
2022, vol.144, no.4
Design of Microfabricated Mechanically Interlocking Metamaterials for Reworkable Heterogeneous Integration
Garcia, Geoffrey A.; Wakumoto, Kody; Brown, Joseph J.
2022
2022, vol.144, no.4
Effect of Different Solder Volumes on the Laser Soldering Process: Numerical and Experimental Investigation
Bachok, Zuraihana; Abas, Mohamad Aizat; Nazarudin, Muhammad Zaim Hanif; Zahiri, Saifulmajdy A.; Sharif, Mohamad Fikri Mohd; Ani, Fakhrozi Che
2022
2022, vol.144, no.4
Damage Analysis in Ag Nanoparticle Interconnect Line Under High-Density Electric Current
Moriwaki, Takeshi; Fujisaki, Kazuhiro; Saito, Daiki; Sasagawa, Kazuhiko
2022
2022, vol.144, no.4
Heat Transfer Analysis of Supercritical Methane in Microchannels With Different Geometric Configurations on High Power Electromechanical Actuator
Gao, Zhigang; Wang, Tianhu; Yang, Yuxin; Shang, Xiaolong; Bai, Junhua; Li, Peng
2022
2022, vol.144, no.4
Design, Development, and Characterization of a Flow Control Device for Dynamic Cooling of Liquid-Cooled Servers
Shahi, Pardeep; Deshmukh, Apruv Pravin; Hurnekar, Hardik Yashwant; Saini, Satyam; Bansode, Pratik; Kasukurthy, Rajesh; Agonafer, Dereje
2022
2022, vol.144, no.4
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