期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024

2023, vol.35, no.1 2023, vol.35, no.2 2023, vol.35, no.3 2023, vol.35, no.4 2023, vol.35, no.5

题名作者出版年年卷期
Thermal and mechanical analysis of low-temperature and low-pressure silver-based sintered thermal jointsStojek, Krzysztof Jakub; Felba, Jan; Nowak, Damian; Malecha, Karol; Kaczmarek, Szymon; Andrzejak, Patryk Tomasz Tomasz20232023, vol.35, no.1
Study on temperature cycling reliability of Sn-5Sb-0.5Cu-0.1Ni-0.5Ag/Cu micro solder jointsXu, Meng; Sun, Fenglian; Pan, Zhen; Liu, Yang20232023, vol.35, no.1
Numerical simulation of reliability of single-sided/double-sided package interconnect structure under temperature cyclic loadHuang, Shun; Liu, Yang; Li, Ke20232023, vol.35, no.1
Investigation of ultrasound-assisted soldering of SiC ceramics by using Zn-Al-In solder for high-temperature applicationsKostolny, Igor; Kolenak, Roman; Babincova, Paulina; Kusy, Martin20232023, vol.35, no.1
Effect of TiO2 nanoparticles on the microstructure, mechanical and thermal properties of rapid quenching SAC355 lead-free solder alloyAlsorory, Hamed Abdulatif; Gumaan, Ammed S. S.; Shalaby, Rizk20232023, vol.35, no.1
Effect of isothermal storage on the microstructure and grain orientation of Cu/Cu3Sn/Cu solder jointYang, Gangli; Li, Xiaoyan; Han, Xu; Li, Shanshan20232023, vol.35, no.1
Micromechanical response of SAC305 solder alloy under gamma radiation via nanoindentation approachYusoff, Wan Yusmawati Wan; Ismail, Norliza; Lehan, Nur Farisa Nadia Mohmad; Amat, Azuraida; Ahmad, Ku Zarina Ku; Jalar, Azman; Rahman, Irman Abdul20232023, vol.35, no.1



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