期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024

2023, vol.35, no.1 2023, vol.35, no.2 2023, vol.35, no.3 2023, vol.35, no.4 2023, vol.35, no.5

题名作者出版年年卷期
Parameter optimization for surface mounter using a self-alignment prediction modelMistry, Maitri; Gupta, Rahul; Jain, Swati; Verma, Jaiprakash V.; Won, Daehan20232023, vol.35, no.2
The impact of intermetallic compound on microstructure, mechanical characteristics, and thermal behavior of the melt-spun Bi-Ag high-temperature lead-free solderShalaby, Rizk Mostala; Allzeleh, Musaeed20232023, vol.35, no.2
Thermal aging effects on the properties of the Cu/(SAC0307 powder + Zn-particles)/Cu joint ultrasonic-assisted soldered at low-temperatureGan, Guisheng; Chen, Shiqi; Jiang, Liujie; Jiang, Zhaoqi; Liu, Cong; Ma, Peng; Cheng, Dayong; Liu, Xin20232023, vol.35, no.2
Mechanical testing and characterization of tin-zinc-antimony-lanthanum lead-free solders produced using mechanical alloying and furnace melting techniquesAnanthapadmanaban, D.; Kathiresan, Arun Vasantha Geethan; Sunderraj, Arthur Jebastine D.20232023, vol.35, no.2
Effect of the IMC layer geometry on a solder joint thermomechanical behaviorCapela, Paulina Araujo; Souza, Maria Sabrina; Costa, Sharlane; Teixeira, Jose C.; Fernandes, Miguel; Figueiredo, Hugo; Delgado, Isabel; Soares, Delfim20232023, vol.35, no.2
Effect of rotating magnetic field on the microstructure and properties of Sn-Ag-Sb lead-free solder alloysWang, Zilong; Zhou, JiaCheng; Liu, Fang; Wu, Yuqin; Yan, Nu20232023, vol.35, no.2
Damping properties of Sn58Bi and Sn3.0Ag0.5Cu solders with different thicknesses and preparation directionsLi, Wangyun; Liu, Linyiang; Li, Xingmin20232023, vol.35, no.2



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