期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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2023, vol.145, no.1 2023, vol.145, no.2 2023, vol.145, no.3

题名作者出版年年卷期
A Time Frequency Domain Based Approach for Ball Grid Array Solder Joint Fatigue Analysis Using Global Local Modeling TechniqueDoranga, Sushil; Xie, Dongji; Lee, Jeffrey; Zhang, Andy; Shi, Xue; Khaldarov, Valeriy20232023, vol.145, no.3
A Comparison of Biaxial Bending Strength of Thin Silicon Dies in the Ball-on-Ring and PoEF TestsTsai, M. Y.; Kuo, T. C.20232023, vol.145, no.3
Multi-Physics Models of a Low-Voltage Power Semiconductor System-in-Package for Automotive ApplicationsMauromicale, Giuseppe; Calabretta, Michele; Scarcella, Giuseppe; Scelba, Giacomo; Sitta, Alessandro20232023, vol.145, no.3
Numerical Analysis of Flow and Heat Transfer Characteristics of Lattice-Based Compact Heat SinksKaur, Inderjot; Mujahid, Shiraz; Paudel, YubRaj; Rhee, Hongjoo; Singh, Prashant20232023, vol.145, no.3
Assessing the SAC305 Solder Joint Fatigue in Ball Grid Array Assembly Using Strain-Controlled and Stress-Controlled ApproachesHamasha, Sa'd; Alahmer, Ali; Belhadi, Mohamed El Amine; Wei, Xin20232023, vol.145, no.3
Numerical Study of Two-Stage Temperature Control Strategy for High-Temperature Stability of Satellite-Borne Fiber Optic GyroscopeChang, Kaifeng; Li, Yun-Ze; Wang, Weishu20232023, vol.145, no.3
Artificial Intelligence for Power Electronics in Electric Vehicles: Challenges and OpportunitiesParet, Paul; Finegan, Donal; Narumanchi, Sreekant20232023, vol.145, no.3
Mandrel Bend Test of Screen-Printed Silver ConductorsChen, Rui; Chow, Justin; Zhou, Yi; Sitaraman, Suresh K.20232023, vol.145, no.3
Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics ApplicationsAlzoubi, Khalid; Hensel, Alexander; Haeussler, Felix; Ottinger, Bettina; Sippel, Marcel; Franke, Joerg20232023, vol.145, no.3
Model Establishment of Chip Air Cooling Process and Its Proportional Integral Differential TuningXu, Linmeng; Zhao, Wanying; Li, Junhui20232023, vol.145, no.3
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