期刊


ISSN0954-0911
刊名Soldering & Surface Mount Technology
参考译名焊接与表面固定技术
收藏年代1999～2024



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013 2014 2015 2016
2017 2018 2019 2020 2021 2022
2023 2024

2024, vol.36, no.1 2024, vol.36, no.2 2024, vol.36, no.3 2024, vol.36, no.4

题名作者出版年年卷期
Effect of Si 3 N 4 nanowires doping on microstructure and properties of Sn58Bi solder for Cu bondingChen, Chen; Zhang, Liang; Huang, Xi; Lu, Xiao20242024, vol.36, no.1
Effect of PVD-coated wall aperture roughness on the life span of fine-pitch stencil printingSunar, Mohamad Solehin Mohamed; Bakar, Maria Abu; Atiqah, A.; Jalar, Azman; Mukhtar, Muhamed Abdul Fatah Muhamed; Ani, Fakhrozi Che20242024, vol.36, no.1
Cu-Cu joint with Sn-58Bi/Porous Cu/Sn-58Bi transient liquid phase bonding under formic acid atmosphereXiong, Bifu; He, Siliang; Ge, Jinguo; Li, Quantong; Hu, Chuan; Yan, Haidong; Shen, Yu-An20242024, vol.36, no.1
Microstructural and mechanical evolution of sintered nano-silver joints on bare copper substrates during high-temperature storageJiang, Meng; Liu, Yang; Li, Ke; Pan, Zhen; Sun, Quan; Tao, Yuan20242024, vol.36, no.1
Flow behavior during solder/Cu column friction plunge micro-weldingZhao, Zhili; Zhang, Mingqiang; Meng, Xi; Li, Zhenkun; Li, Jiazhe; Qiu, Luying; Ren, Zeyu20242024, vol.36, no.1
Interfacial reactions in the Sn-9.0 wt.% Zn/Cu-Ti alloy (C1990 HP) coupleLaksono, Andromeda Dwi; Chen, Chih-Ming; Yen, Yee-Wen20242024, vol.36, no.1
Deep learning and analytical study of void regional formation in flip-chip underfilling processLing, Calvin; Azahari, Muhammad Taufik; Abas, Mohamad Aizat; Ng, Fei Chong20242024, vol.36, no.1



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