期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2025



全部

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2025

2024, vol.146, no.2 2024, vol.146, no.3 2024, vol.146, no.4

题名作者出版年年卷期
Special Issue on InterPACK2023Warzoha, Ronald J.; Agonofer, Damena; Giri, Ashutosh; Shah, JimilWarzoha, Ronald J.; Agonofer, Damena; Giri, Ashutosh; Shah, Jimil20242024, vol.146, no.4
Electrochemical Additive Manufacturing-Based Design of a Heat Sink for Single-Phase Natural Convection Immersion Cooling ApplicationLamotte-Dawaghreh, Jacob; Herring, Joseph; Pundla, Sai Abhideep; Suthar, Rohit; Nair, Vivek; Bansode, Pratik; Gupta, Gautam; Agonafer, Dereje; Madril, Joseph; Ouradnik, Tim; Matthews, Michael; Winfield, IanLamotte-Dawaghreh, Jacob; Herring, Joseph; Pundla, Sai Abhideep; Suthar, Rohit; Nair, Vivek; Bansode, Pratik; Gupta, Gautam; Agonafer, Dereje; Madril, Joseph; Ouradnik, Tim; Matthews, Michael; Winfield, Ian20242024, vol.146, no.4
Cold Gas Spraying Copper Metal on AlN Ceramics as an Alternative to Thick Direct Bond Copper Substrates for Power ElectronicsGuerrero-Fernandez, Margie; Quintero, Pedro; Ozdemir, Ozan CagatayGuerrero-Fernandez, Margie; Quintero, Pedro; Ozdemir, Ozan Cagatay20242024, vol.146, no.4
Enhancing Mechanical Reliability of Silver-Sintered Joints With Copper Nanowires in High-Power Electronic DevicesGarcia, Alicia Medina; Harris, John; Huitink, David R.Garcia, Alicia Medina; Harris, John; Huitink, David R.20242024, vol.146, no.4
Behavior of Polymeric Substrates and Sintered Silver Printed Hybrid Electronic Assemblies Subject to Extreme Acceleration Levels and Elevated TemperaturesRichards, Hayden; Abusalma, Hisham; Dasgupta, Abhijit; Bujanda, Andres; Tsang, Harvey; Bowman, MatthewRichards, Hayden; Abusalma, Hisham; Dasgupta, Abhijit; Bujanda, Andres; Tsang, Harvey; Bowman, Matthew20242024, vol.146, no.4
Experimental and Numerical Investigation of Single-Phase Liquid Cooling for Heterogeneous Integration Multichip ModuleGharaibeh, Ahmad R.; Soud, Qusai; Manaserh, Yaman; Tradat, Mohammad; Sammakia, BahgatGharaibeh, Ahmad R.; Soud, Qusai; Manaserh, Yaman; Tradat, Mohammad; Sammakia, Bahgat20242024, vol.146, no.4
Process Recipe and Functional Circuitry Performance on Aerosol Jet Printed Water-Based Silver InkLall, Pradeep; Bimali, Sabina; Miller, ScottLall, Pradeep; Bimali, Sabina; Miller, Scott20242024, vol.146, no.4
Impact of Immersion Cooling on Thermomechanical Properties of Halogen-Free Substrate CoreBansode, Pratik; Suthar, Rohit; Bhandari, Rabin; Lakshminarayana, Akshay; Eda, Naga Tejesh; Gupta, Gautam; Simon, Vibin; Modi, Himanshu; Nair, Vivek; Shahi, Pardeep; Saini, Satyam; Sivaraju, Krishna Bhavana; Agonafer, DerejeBansode, Pratik; Suthar, Rohit; Bhandari, Rabin; Lakshminarayana, Akshay; Eda, Naga Tejesh; Gupta, Gautam; Simon, Vibin; Modi, Himanshu; Nair, Vivek; Shahi, Pardeep; Saini, Satyam; Sivaraju, Krishna Bhavana; Agonafer, Dereje20242024, vol.146, no.4
Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet ProcessesAbusalma, Hisham; Richards, Hayden; Dasgupta, Abhijit; Bujanda, Andres; Tsang, Harvey; Yu, JianAbusalma, Hisham; Richards, Hayden; Dasgupta, Abhijit; Bujanda, Andres; Tsang, Harvey; Yu, Jian20242024, vol.146, no.4
Convection Cooling of Power Electronics Operating in Deep-SpaceHarsono, Jessica; Kozak, Joseph P.; Tomey, Hala; Yerkes, William; Neville, JonathanHarsono, Jessica; Kozak, Joseph P.; Tomey, Hala; Yerkes, William; Neville, Jonathan20242024, vol.146, no.4
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