期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2025



全部

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2025

2024, vol.146, no.2 2024, vol.146, no.3 2024, vol.146, no.4

题名作者出版年年卷期
Development of a Thermal Metrology Standard for Evaluation of Cold Plate Thermal Resistance as a Performance MetricMartinez, Victor A.; Caceres, Carol; Ortega, AlfonsoMartinez, Victor A.; Caceres, Carol; Ortega, Alfonso20242024, vol.146, no.4
Virtual Testbed for Economical and Reliability Analysis of Battery Thermal Management Control StrategiesOlyaei, Mostafa; Singh, Sagar; Jiang, Kaiying; Gurumukhi, Yashraj; Goodson, Kenneth; Asheghi, Mehdi; Miljkovic, NenadOlyaei, Mostafa; Singh, Sagar; Jiang, Kaiying; Gurumukhi, Yashraj; Goodson, Kenneth; Asheghi, Mehdi; Miljkovic, Nenad20242024, vol.146, no.4
Reliability Assessment and Multiphysics Simulation of Additively Printed Wearable Humidity Sensor With Supercapacitive Material for Astronaut in Extreme ConditionLall, Pradeep; Jang, Hyesoo; Hill, CurtisLall, Pradeep; Jang, Hyesoo; Hill, Curtis20242024, vol.146, no.4
Performance Analysis of Liquid-to-Air Heat Exchanger of High-Power Density RacksHeydari, Ali; Gharaibeh, Ahmad R.; Tradat, Mohammad; Soud, Qusai; Manaserh, Yaman; Radmard, Vahideh; Eslami, Bahareh; Rodriguez, Jeremy; Sammakia, BahgatHeydari, Ali; Gharaibeh, Ahmad R.; Tradat, Mohammad; Soud, Qusai; Manaserh, Yaman; Radmard, Vahideh; Eslami, Bahareh; Rodriguez, Jeremy; Sammakia, Bahgat20242024, vol.146, no.4
Liquid-to-Air Coolant Distribution Units Performance and Considerations for Server Rooms Upgrade With Conventional Air ConditioningHeydari, Ali; Soud, Qusai; Tradat, Mohammad; Gharaibeh, Ahmad R.; Fallahtafti, Najmeh; Rodriguez, Jeremy; Sammakia, BahgatHeydari, Ali; Soud, Qusai; Tradat, Mohammad; Gharaibeh, Ahmad R.; Fallahtafti, Najmeh; Rodriguez, Jeremy; Sammakia, Bahgat20242024, vol.146, no.4
Variable Area Jet Impingement for Enhanced Junction Temperature Control of High-Power ElectronicsWhitt, Reece; Huitink, DavidWhitt, Reece; Huitink, David20242024, vol.146, no.4
Methodology to Characterize Row Manifolds for High Power Direct to Chip Liquid Cooling Data CentersShahi, Pardeep; Heydari, Ali; Eslami, Bahareh; Radmard, Vahideh; Hinge, Chandraprakash; Modi, Himanshu; Chinthaparthy, Lochan Sai Reddy; Tradat, Mohammad; Agonafer, Dereje; Rodriguez, JeremyShahi, Pardeep; Heydari, Ali; Eslami, Bahareh; Radmard, Vahideh; Hinge, Chandraprakash; Modi, Himanshu; Chinthaparthy, Lochan Sai Reddy; Tradat, Mohammad; Agonafer, Dereje; Rodriguez, Jeremy20242024, vol.146, no.4
Thermal-Hydraulic Characterization of a Thermosyphon Cooling System for Highly Compact Edge MicroDataCenterMinazzo, Enzo M.; Rouaze, Gautier; Marcinichen, Jackson B.; Thome, John R.; Buining, FredMinazzo, Enzo M.; Rouaze, Gautier; Marcinichen, Jackson B.; Thome, John R.; Buining, Fred20242024, vol.146, no.4
Thermal Property Estimation of Thin-Layered Structures by Means of Thermoreflectance Measurement and Network Identification by Deconvolution AlgorithmHiguma, Daiki; Silveira, Joao Vitor Thomsen; Kim, Byunggi; Nomura, Masahiro; Fushinobu, KazuyoshiHiguma, Daiki; Silveira, Joao Vitor Thomsen; Kim, Byunggi; Nomura, Masahiro; Fushinobu, Kazuyoshi20242024, vol.146, no.4
Thermal Spreading Resistance of Surface Adjacent Localized Heating-Induced Size Effects in SemiconductorsAbdolhosseinzadeh, Amir; Donmezer, NazliAbdolhosseinzadeh, Amir; Donmezer, Nazli20242024, vol.146, no.4
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