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期刊
ISSN
0914-4935
刊名
Sensors and materials
参考译名
传感器与材料
收藏年代
1998~2023
全部
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2005, vol.17, no.1
2005, vol.17, no.2
2005, vol.17, no.3
2005, vol.17, no.4
2005, vol.17, no.5
2005, vol.17, no.6
2005, vol.17, no.7
2005, vol.17, no.8
题名
作者
出版年
年卷期
Room Temperature Direct Wafer Bonding for Three Dimensional Integrated Sensors
Paul Enquist
2005
2005, vol.17, no.6
Locating and Tracking the Evolution of Debonds at the Interface of Bonded Semiconductor Devices Using Infrared Photoelasticity
Gavin Horn; Thomas J. Mackin; Jon Lesniak
2005
2005, vol.17, no.6
Effects of Implantation Heating on Exfoliation of InP
Sumiko Hayashi; Rajinder Sandhu; David Bruno; Mike Wojtowicz; Mark S. Goorsky
2005
2005, vol.17, no.6
Introduction of InP-Based Light Emitter into GaAs-Based 3D Photonic Crystal by Improved Wafer Bonding of Dissimilar Materials
Masahiro Imada; Shinpei Ogawa; Susumu Yoshimoto; Susumu Noda
2005
2005, vol.17, no.6
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