期刊


ISSN0268-3768
刊名The International Journal of Advanced Manufacturing Technology
参考译名先进制造技术国际杂志
收藏年代1998～2023



全部

1998 1999 2000 2001 2002 2003
2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2014 2015
2016 2017 2018 2019 2020 2021
2022 2023

2001, vol.17, no.1 2001, vol.17, no.10 2001, vol.17, no.11 2001, vol.17, no.12 2001, vol.17, no.2 2001, vol.17, no.3
2001, vol.17, no.4 2001, vol.17, no.5 2001, vol.17, no.6 2001, vol.17, no.7 2001, vol.17, no.8 2001, vol.17, no.9
2001, vol.18, no.1 2001, vol.18, no.10 2001, vol.18, no.11 2001, vol.18, no.12 2001, vol.18, no.2 2001, vol.18, no.3
2001, vol.18, no.4 2001, vol.18, no.5 2001, vol.18, no.6 2001, vol.18, no.7 2001, vol.18, no.8 2001, vol.18, no.9

题名作者出版年年卷期
Recent advances in machining of silicon wafers for semiconductor applicationsP. S. Sreejith; G. Udupa; Y. B. M. Noor; B. K. A. Ngoi20012001, vol.17, no.3
Selection of the machining inclination angle in high-speed ball end millingT. J. Ko; H. S. Kim; S. S. Lee20012001, vol.17, no.3
A framwork for laser scan planning of freeform surfacesK. H. Lee; H. Park; S. Son20012001, vol.17, no.3
Robust spiral too-path generation for arbitrary pocketsChun-Fong You; Bor-Tyng Sheen; Tzu-Kuan Lin20012001, vol.17, no.3
Application of ball bar system and genetic algorithms for CNC lathe contouring compensationWen-Yuh Jywe; Chien-Hong Liu20012001, vol.17, no.3
Laser forming with constant line energyWenchuan Li; Y. Lawrence Yao20012001, vol.17, no.3
The application of the skipped layer interior method and higher deposition height to accelerate fabrication speed of the model maker rapid prototyping systemJ. -Y. Jeng; J. -C. Wang; T. T. Lin20012001, vol.17, no.3
Optimising operation conditions by selection of optimal threshold value for digital-digital dynamic characteristicsM. -H. Caleb Li20012001, vol.17, no.3
Application of a layout/material handling design method to a furnace area in a 300 mm wafer fabP. M. C. Hesen; P. J. J. Renders; J. E. Rooda20012001, vol.17, no.3
Intelligent machine tools in a distributed network manufacturing mode environmnetTao Cheng; Jie Zhang; Chunhua Hu; Bo Wu; Shuzi Yang20012001, vol.17, no.3



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