期刊


ISSN1345-9678
刊名Materials Transactions
参考译名材料汇刊
收藏年代2003～2013

关联期刊参考译名收藏年代
Materials Transactions, JIM日本金属学会材料汇刊1998～2003


全部

2003 2004 2005 2006 2007 2008
2009 2010 2011 2012 2013

2004, vol.45, no.1 2004, vol.45, no.10 2004, vol.45, no.11 2004, vol.45, no.12 2004, vol.45, no.2 2004, vol.45, no.3
2004, vol.45, no.4 2004, vol.45, no.5 2004, vol.45, no.6 2004, vol.45, no.7 2004, vol.45, no.8 2004, vol.45, no.9

题名作者出版年年卷期
Microstructure and Strength of Sn-Bi Coated Sn-3.5mass%Ag Solder AlloyJaesik Lee; Woongho Bang; Jaepil Jung; Kyuhwan Oh20042004, vol.45, no.3
Eutectic Alloys in the Sn-Zn-Mg-Al System with Eutectic Temperature of 454 KMasanori Inada; Masaki Kibe20042004, vol.45, no.3
Influence of Noble Metal Coating on Wettability of Copper Substrate by Sn-Ag Eutectic SolderHisaaki Takao; Hideo Hasegawa20042004, vol.45, no.3
Microstructures, Thermal and Tensile Properties of Sn-Zn-Ga AlloysJenn-Ming Song; Nai-Shuo Liu; Kwang-Lung Lin20042004, vol.45, no.3
IMC Growth and Shear Strength of Sn-Ag-Bi-In/Au/Ni/Cu BGA Joints During AgingJeong-Won Yoon; Sang-Won Kim; Seung-Boo Jung20042004, vol.45, no.3
Microstructures and Shear Strength of Interfaces between Sn-Zn Lead-free Solders and Au/Ni/Cu UBMKyung-Seob Kim; Jun-Mo Yang; Chong-Hee Yu; Hyo-Joeng Jeon20042004, vol.45, no.3
Influence of the Interfacial Reaction Layer on Reliability of CSP Joints Using Sn-8Zn-3Bi Solder and Ni/Au PlatingYousuke Sogo; Takashi Hojo; Hiroaki Iwanishi; Akio Hirose; Kojiro F. Kobayashi; Atsushi Yamaguch; Akio Furusawa; Kazuto Nishida20042004, vol.45, no.3
The Effect of Reduction Capability of Resin Material on the Solder Wettability for Electrically Conductive Adhesives (ECAs) AssemblyJong-Min Kim; Kiyokazu Yasuda; Masahiro Yasuda; Kozo Fujimoto20042004, vol.45, no.3
Effect of Iron Plating Conditions on Reaction in Molten Lead-Free SolderHiroshi Nishikawa; Tadashi Takemoto; Kouichi Kifune; Takashi Uetani; Norihisa Sekimori20042004, vol.45, no.3
Application of Thermal Latent Carboxylic Acid Derivatives to Pb-Free MicrosolderingShun Saito; Katumi Nakasato; Yukihiro Katoh; Yoshihiro Oshibe; Masahiro Ishidoya20042004, vol.45, no.3
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