期刊


ISSN1345-9678
刊名Materials Transactions
参考译名材料汇刊
收藏年代2003～2013

关联期刊参考译名收藏年代
Materials Transactions, JIM日本金属学会材料汇刊1998～2003


全部

2003 2004 2005 2006 2007 2008
2009 2010 2011 2012 2013

2005, vol.46, no.1 2005, vol.46, no.10 2005, vol.46, no.11 2005, vol.46, no.12 2005, vol.46, no.2 2005, vol.46, no.3
2005, vol.46, no.4 2005, vol.46, no.5 2005, vol.46, no.6 2005, vol.46, no.7 2005, vol.46, no.8 2005, vol.46, no.9

题名作者出版年年卷期
Mechanism and Prevention of Spontaneous Tin Whisker GrowthKing-Ning Tu; Jong-ook Suh; Albert Tzu-Chia Wu; Nobumichi Tamura; Chih-Hang Tung20052005, vol.46, no.11
Isothermal Fatigue Properties of Sn-Ag-Cu Alloy Evaluated by Micro Size SpecimenYoshiharu Kariya; Tomokazu Niimi; Tadatomo Suga; Masahisa Otsuka20052005, vol.46, no.11
Fatigue Reliability Evaluation for Sn-Zn-Bi and Sn-Zn Lead-Free Solder JointsQiang Yu; Jae-Chul Jin; Do-Seop Kim; Masaki Shiratori20052005, vol.46, no.11
Reliability of Sn-8 mass%Zn-3 mass%Bi Lead-Free Solder and Zn BehaviorSun-Yun Cho; Young-Woo Lee; Kyoo-Seok Kim; Young-Jun Moon; Ji-Won Lee; Hyun-Joo Han; Mi-Jin Kim; Jae-Pil Jung20052005, vol.46, no.11
Estimation of Thermal Fatigue Resistances of Sn-Ag and Sn-Ag-Cu Lead-Free Solders Using Strain Rate Sensitivity IndexIkuo Shohji; Kiyokazu Yasuda; Tadashi Takemoto20052005, vol.46, no.11
Fatigue Damage Evaluation by Surface Feature for Sn-3.5Ag and Sn-0.7Cu SoldersTakehiko Takahashi; Susumu Hioki; Ikuo Shohji; Osamu Kamiya20052005, vol.46, no.11
Formation of Intermetallic Compounds in the Ni Bearing Lead Free Composite SoldersJoo Won Lee; Zin Hyoung Lee; Hyuck Mo Lee20052005, vol.46, no.11
IMC Growth of Solid State Reaction between Ni UBM and Sn-3Ag-0.5Cu and Sn-3.5Ag Solder Bump Using Ball Place Bumping Method during AgingShinji Ishikawa; Eiji Hashino; Taro Kono; Kohei Tatsumi20052005, vol.46, no.11
Flip Chip Bump Formation of Sn-1.8Bi-0.8Cu-0.6In Solder by Stencil PrintingJaesik Lee; Jae-Pil Jung; Chu-Seon Cheon; Yunhong Zhou; Michael Mayer20052005, vol.46, no.11
Microstructure and Mechanical Properties of Sn-0.7Cu Flip Chip Solder Bumps Using Stencil Printing MethodDae-Gon Kim; Seung-Boo Jung20052005, vol.46, no.11
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