期刊


ISSN1345-9678
刊名Materials Transactions
参考译名材料汇刊
收藏年代2003～2013

关联期刊参考译名收藏年代
Materials Transactions, JIM日本金属学会材料汇刊1998～2003


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2003 2004 2005 2006 2007 2008
2009 2010 2011 2012 2013

2010, vol.51, no.1 2010, vol.51, no.10 2010, vol.51, no.11 2010, vol.51, no.12 2010, vol.51, no.2 2010, vol.51, no.3
2010, vol.51, no.4 2010, vol.51, no.5 2010, vol.51, no.6 2010, vol.51, no.7 2010, vol.51, no.8 2010, vol.51, no.9

题名作者出版年年卷期
A Reliability Study of Nanoparticles Reinforced Composite Lead-Free SolderSi Chen; Lili Zhang; Johan Liu; Yulai Gao; Qijie Zhai20102010, vol.51, no.10
Effects of Zn-Bearing Flux on Joint Reliability and Microstructure of Sn-3.5Ag Soldering on Electroless Ni-Au Surface FinishHitoshi Sakurai; Youichi Kukimoto; Seongjun Kim; Alongheng Baated; Kiju Lee; Keun-Soo Kim; Seishi Kumamoto; Katsuaki Suganuma20102010, vol.51, no.10
Effect of In Addition on Wetting Properties of Sn-Zn-In/Cu SolderingYi Ta Wang; Chung Jen Ho; Hsien Lung Tsai20102010, vol.51, no.10
Effects of Post-Plating Reflow on Changes in Crystal Grain Size of Sn-2 mass%Bi Alloy Plating with Thermal Cycling TreatmentNoriyuki Kuwano; Atsushi Jinnouchi; Sadanori Horikami; Naruyoshi Hirokado; Harini Sosiati20102010, vol.51, no.10
Effect of Small Addition of Zinc on Creep Behavior of TinNaoyuki Hamada; Masakazu Hamada; Tokuteru Uesugi; Yorinobu Takigawa; Kenji Higashi20102010, vol.51, no.10
Fluxless Bonding of Ni-P/Cu Plated Al Alloy and Cu Alloy with Lead-Free Sn-Cu FoilIkuo Shohji; Shinji Koyama; Itaru Oshiro; Hideaki Nara; Yoshiharu Iwata20102010, vol.51, no.10
Effect of Formic Acid Surface Modification on Bond Strength of Solid-State Bonded Interface of Tin and CopperShinji Koyama; Yukinari Aoki; Ikuo Shohji20102010, vol.51, no.10
Synthesis of Highly Concentrated Ag Nanoparticles in a Heterogeneous Solid-Liquid System under Ultrasonic IrradiationKenta Toisawa; Yamato Hayashi; Hirotsugu Takizawa20102010, vol.51, no.10
Synthesis of Carbon Nanotube/Silver Nanocomposites by UltrasonicationTakahiro Yamada; Yamato Hayashi; Hirotsugu Takizawa20102010, vol.51, no.10
Transmission Electron Microscopy Study on Microstructure of Ag-Based Conductive AdhesivesNaoyuki Kawamoto; Yasukazu Murakami; Daisuke Shindo; Yuichiro Hayasaka; Takeshi Kan; Katsuaki Suganuma20102010, vol.51, no.10
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