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期刊
ISSN
0957-4522
刊名
Journal of Materials Science
参考译名
材料科学杂志:电子材料
收藏年代
1999~2013
全部
1999
2000
2001
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
2013
2005, vol.16, no.1
2005, vol.16, no.10
2005, vol.16, no.11-12
2005, vol.16, no.2
2005, vol.16, no.3
2005, vol.16, no.4
2005, vol.16, no.5
2005, vol.16, no.6
2005, vol.16, no.7
2005, vol.16, no.8
2005, vol.16, no.9
题名
作者
出版年
年卷期
Improvement of porous polysilicon nano-structured emitter for vacuum packaged devices
JOO-WON LEE; KYEONG-KAP PAEK; JIN JANG; BYEONG-KWON JU
2005
2005, vol.16, no.3
Spin-valve effect in an FM/Si/FM junction
K. I. LEE; H. J. LEE; J. Y. CHANG; S. H. HAN; Y. K. KIM; W. Y. LEE
2005
2005, vol.16, no.3
Superconductors of the BPSCCO system obtained from rapid cooling process
C. L. CARVALHO; K. YUKIMITU; V. C. S. REYNOSO; J. C. S. MORAES; E. B. ARAUJO; N. ALVES; S. RAINHO
2005
2005, vol.16, no.3
The use of yttrium (III) isopropoxide to improve thermal conductivity of polycrystalline aluminum nitride (AlN) ceramics
ADOLFO FRANCO JUNIOR; DANIEL J. SHANAFIELD
2005
2005, vol.16, no.3
DC conduction behaviour of niobium doped barium stannate
PRABHAKAR SINGH; OM PARKASH; DEVENDRA KUMAR
2005
2005, vol.16, no.3
Microwave dielectric properties of Ba{sub}(5+n)Ti{sub}nNb{sub}4O{sub}(15+3n) ceramics
LIANG FANG; L. CHEN; HUI ZHANG; X. K. HONG; C. L. DIAO; H. X. LIU
2005
2005, vol.16, no.3
Interfacial reactions of Sn-3.5% Ag and Sn-3.5% Ag-0.5% Cu solder with electroless Ni/Au metallization during multiple reflow cycles
AHMED SHARIF; Y. C. CHAN
2005
2005, vol.16, no.3
Solution route synthesis and characterization of nanocrystalline Bi{sub}2Ru{sub}2O{sub}7 for usage in resistor paste application
K. GURUNATHAN; N. P. VYAWAHARE; G. J. PHATAK; D. P. AMALNERKAR
2005
2005, vol.16, no.3
Role of imposed cyclic straining on the stress relaxation behavior of eutectic Sn-3.5Ag solder joints
H. RHEE; K. N. SUBRAMANIAN; A. LEE
2005
2005, vol.16, no.3
An analysis of the distributions of electronic states associated with hydrogenated amorphous silicon
SAAD M. MALIK; STEPHEN K. O'LEARY
2005
2005, vol.16, no.3
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