期刊


ISSN0957-4522
刊名Journal of Materials Science
参考译名材料科学杂志:电子材料
收藏年代1999~2013



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2009, vol.20, no.1 2009, vol.20, no.10 2009, vol.20, no.11 2009, vol.20, no.12 2009, vol.20, no.2 2009, vol.20, no.3
2009, vol.20, no.4 2009, vol.20, no.5 2009, vol.20, no.6 2009, vol.20, no.7 2009, vol.20, no.8 2009, vol.20, no.9

题名作者出版年年卷期
Fabrication and characterization of ZnO film based UV photodetectorC. Y. Liu; B. P. Zhang; Z. W. Lu; N. T. Binh; K. Wakatsuki; Y. Segawa; R. Mu20092009, vol.20, no.3
Wet route to silicon oxide quantum dots with fixed and strong blue emissionHuazhong Gao; Mingwang Shao; Sheng Wang; Yan Fu20092009, vol.20, no.3
Photoelectrochemical behaviour of pulse plated CdS filmsK. R. Murali; P. Thirumoorthy; V. Sengodan20092009, vol.20, no.3
Electrical properties of manganese modified sodium potassium lithium niobate lead-free piezoelectric ceramicsRuzhong Zuo; Jian Fu; Shi Su; Xusheng Fang; Jiang-Li Cao20092009, vol.20, no.3
A SERS study of the galvanostatic sequence used for the electrochemical deposition of copper from baths employed in the fabrication of interconnectsLucia D'Urzo; Benedetto Bozzini20092009, vol.20, no.3
Dispersion of single-walled carbon nanotubes in aqueous and organic solvents through a polymer wrapping functionalizationS. Manivannan; Il Ok Jeong; Je Hwang Ryu; Chang Seok Lee; Ki Seo Kim; Jin Jang; Kyu Chang Park20092009, vol.20, no.3
Study of lattice damage produced by neon implantation into AlInNAbdul Majid; Akbar Ali; J. J. Zhu; Y. T. Wang20092009, vol.20, no.3
Effect of powder bed on the microstructure and electrical properties of Bi{sub}2O{sub}3- and Sb{sub}2O{sub}3-doped ZnOYeh-Wu Lao; Shu-Ting Kuo; Wei-Hsing Tuan20092009, vol.20, no.3
Electrical and transport properties of nickel manganite obtained by Hall effect measurementsS. M. Savic; G. M. Stojanovic; M. V. Nikolic; O. S. Aleksic; D. T. Lukovic Golic; P. M. Nikolic20092009, vol.20, no.3
Microstructure and dielectric properties of CBS glass-doped Sr{sub}0.5Ba{sub}0.5Nb{sub}2O{sub}6 ceramic systemGuo-hua Chen; Bing Qi20092009, vol.20, no.3
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