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期刊
ISSN
0916-1821
刊名
Materials Transactions, JIM
参考译名
日本金属学会材料汇刊
收藏年代
1998~2003
关联期刊
参考译名
收藏年代
Materials Transactions
材料汇刊
2003~2013
全部
1998
1999
2000
2001
2002
2003
2001, vol.42, no.1
2001, vol.42, no.10
2001, vol.42, no.11
2001, vol.42, no.12
2001, vol.42, no.2
2001, vol.42, no.3
2001, vol.42, no.4
2001, vol.42, no.5
2001, vol.42, no.6
2001, vol.42, no.7
2001, vol.42, no.8
2001, vol.42, no.9
题名
作者
出版年
年卷期
Thermodynamic analysis of the Sn-Ag-Bi ternary phase diagram
Hiroshi Ohtani; Isamu Satoh; Masamitsu Miyashita; Kiyohito Ishida
2001
2001, vol.42, no.5
Activity measurement of the constituents in molten Ag-In-Sn ternary alloy by mass spectrometry
Takahiro Miki; Naotaka Ogawa; Tetsuya Nagasaka; Mitsutaka Hino
2001
2001, vol.42, no.5
Effect of Ag addition the microstructural and mechanical properties of Sn-Cu eutectic solder
Seok-Hwan Huh; Keun-Soo Kim; Katsuaki Suganuma
2001
2001, vol.42, no.5
Effect of excess temperature above liquidus of lead-free solders on wetting time in a wetting balance test
Tadashi Takemoto; Makoto Miyazaki
2001
2001, vol.42, no.5
The effect of Bi concentration on wettability of cu substrate by Sn-Bi solders
Chang-Bae Lee; Seung-Boo Jung; Young-Eui Shin; Chang-Chae Shur
2001
2001, vol.42, no.5
Effect of Cu in Pb Free solder ball on the microstructure of BGA joints with Au/Ni coated cu Pads
Keisuke Uenishi; Toshio Saeki; Yasuhiro Kohara; Kojiro F. Kobayashi; Ikuo Shoji; Masataka Nishiura; Masaharu Yamamoto
2001
2001, vol.42, no.5
Effect of cooling rate on microstructure and strength properties of tin-silver-copper solder ball bonding
Kunihiro Noguchi; Mayumi Ikeda; Isao Shimizu; Yoshito Kawamura; Yasuhide Ohno
2001
2001, vol.42, no.5
Aging behavior of a Sn-Bi eutectic solder at temperatures between 233 and 373K
Jia Ning Hu; Hiroyuki Tanaka; Toshio Narita
2001
2001, vol.42, no.5
Influences of aging treatment on microstructure and hardness of Sn-(Ag, Bi, Zn)eutectic solder alloys
Yasuyuki Miyazawa; Tadashi Ariga
2001
2001, vol.42, no.5
Effect of in addition on Sn-3.5Ag solder and joint with cu substrate
Won Kyoung Choi; Seung Wook Yoon; Hyuck Mo Lee
2001
2001, vol.42, no.5
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