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期刊
ISSN
0916-1821
刊名
Materials Transactions, JIM
参考译名
日本金属学会材料汇刊
收藏年代
1998~2003
关联期刊
参考译名
收藏年代
Materials Transactions
材料汇刊
2003~2013
全部
1998
1999
2000
2001
2002
2003
2002, vol.43, no.1
2002, vol.43, no.10
2002, vol.43, no.11
2002, vol.43, no.12
2002, vol.43, no.2
2002, vol.43, no.3
2002, vol.43, no.4
2002, vol.43, no.5
2002, vol.43, no.6
2002, vol.43, no.7
2002, vol.43, no.8
2002, vol.43, no.9
题名
作者
出版年
年卷期
Role of electrode potential difference between lead-free solder and copper base metal in wetting
Tadashi Takemoto; Tatsuya Funki
2002
2002, vol.43, no.8
Shear strength and interfacial compound of Sn-Ag-Bi-In alloy
Moon-Il Kim; Joon-Kwon Moon; Jae-Pil Jung
2002
2002, vol.43, no.8
Interface reaction and mechanical properties of lead-free Sn-Zn alloy/Cu joints
Ikuo Shohji; Takao Nakamura; Fuminari Mori; Shinichi Fujiuchi
2002
2002, vol.43, no.8
Mechanical strength and microstructure of BGA joints using lead-free solders
Masataka Nishiura; Akihiro Nakayama; Sigeaki Sakatani; Yasuhiro Kohara; Keisuke Uenishi; Kojiro F. Kobayashi
2002
2002, vol.43, no.8
Mechanical properties and microstructure of tin-silver-bismuth lead-free solder
Hanae Shimokawa; Tasao Soga; Koji Serizawa
2002
2002, vol.43, no.8
Numerical simulation of dynamic wetting behavior in the wetting balance method
Jeong Whan Han; Hwang Gu Lee; Jae Yong Park
2002
2002, vol.43, no.8
Interfacial reactions between Sn-58mass%Bi eutectic solder and (Cu, electroless Ni-P/Cu) substrate
Jeong-Won Yoon; Chang-Bae Lee; Seung-Boo Jung
2002
2002, vol.43, no.8
Effects of alloying in near-eutectic tin-silver-copper solder joints
Iver E. Anderson; Bruce A. Cook; Joel Harringa; Robert L. Terpstra; James C. Foley; Ozer Unal
2002
2002, vol.43, no.8
Melting and joining behavior of Sn/Ag and Sn-Ag/Sn-Bi plating on Cu core ball
Keisuke Uenishi; Yasuhiro Kohara; Shigeaki Sakatani; Toshio Saeki; Kojiro F. Kobayashi; Masaharu Yamamoto
2002
2002, vol.43, no.8
Influence of phosphorus concentration in electroless plated Ni-P alloy film on interfacial structures and strength between Sn-Ag-(Cu) solder and plated Ni-P alloy film
Yasunori Chonan; Takao Komiyama; Jin Onuki; Ryoichi Urao; Takashi Kimura; Takahiro Nagano
2002
2002, vol.43, no.8
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