期刊


ISSN0914-4935
刊名Sensors and materials
参考译名传感器与材料
收藏年代1998～2023



全部

1998 1999 2000 2001 2002 2003
2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2014 2015
2016 2017 2018 2019 2020 2021
2022 2023

2018, vol.30, no.1 2018, vol.30, no.10 Pt.1 2018, vol.30, no.12 Pt.1 2018, vol.30, no.12 Pt.2 2018, vol.30, no.12 Pt.3 2018, vol.30, no.2
2018, vol.30, no.3 2018, vol.30, no.3 Pt.2 2018, vol.30, no.4 Pt.1 2018, vol.30, no.4 Pt.2 2018, vol.30, no.5 Pt.1 2018, vol.30, no.5 Pt.2
2018, vol.30, no.6 Pt.1 2018, vol.30, no.6 Pt.2 2018, vol.30, no.7 Pt.1 2018, vol.30, no.7 Pt.2 2018, vol.30, no.8 Pt.1 2018, vol.30, no.8 Pt.2
2018, vol.30, no.9 Pt.1 2018, vol.30, no.9 Pt.2

题名作者出版年年卷期
In situ Monitoring of Vapor-phase Polymerization and Characterization of Poly(3,4-ethylenedioxythiophene) Thin FilmsKoshiba, Yasuko; Hirai, Mana; Horike, Shohei; Morimoto, Masahiro; Misaki, Masahiro; Fukushima, A. Tastuya; Ishida, Kenji20182018, vol.30, no.12 Pt.2
Asymmetric Line Shape of Near-field Luminescence Spectrum Induced by Stress in Al2O3Tomimatsu, Tort; Takigawa, Ryo20182018, vol.30, no.12 Pt.2
Stress-enhanced Cu-to-Cu Bonding for MEMS PackagingSong, Jenn-Ming; Lang, Sin-Yong; Xie, Zong-Yu; Chiang, Po-Hao; Huang, Shang-Kun; Chiu, Ying-Ta; Tarng, David; Hung, Chih-Pin; Lin, Jing-Yuan20182018, vol.30, no.12 Pt.2
Room-temperature Hermetic Packaging Using Ultrasonic Cu-Cu Bonding with Compliant RimTakigawa, Ryo; Iwanabe, Keiichiro; Ikeda, Akihiro; Takao, Takayuki; Asano, Tanemasa20182018, vol.30, no.12 Pt.2
Fine Cone-shaped Bumps for Three-dimensional LSI Package-An Optimization of Thermocompression Bonding ProcessNemoto, Shunsuke; Lim, Ying Ying; Nakagawa, Hiroshi; Kikuchi, Katsuya; Aoyagi, Masahiro20182018, vol.30, no.12 Pt.2
Microgravity Generation Using Tilting Board for Resolution Evaluation of MEMS AccelerometerTakayasu, Motohiro; Tsuji, Ippei; Ito, Hiroyuki; Yamane, Daisuke; Dosho, Shiro; Konishi, Toshifumi; Ishihara, Noboru; Machida, Katsuyuki; Masu, Kazuya20182018, vol.30, no.12 Pt.2
Exploring Land Cover Classification Accuracy of Landsat 8 Image Using Spectral Index Layer Stacking in Hilly Region of South KoreaLee, Jae Kang; Acharya, Tri Dev; Lee, Dong Ha20182018, vol.30, no.12 Pt.2
Antenna Sensor for Radio-wave-type EndoscopeFujimoto, Takafumi; Kawashima, Keiya; Horiguchi, Genki; Tanaka, Toshiyuki20182018, vol.30, no.12 Pt.2
Wake-up Radio-resilient Scanning Mechanism for Mobile Device in IEEE 802.11baPark, Hyunhee; Kim, Eui-Jik20182018, vol.30, no.12 Pt.2
Impedance-matched Planar-antenna-integrated High-efficiency Push-pull Power Amplifier with Center-tapped Transformer for 5 GHz Wireless CommunicationKuboki, Takeshi; Sadakiyo, Tomoki; Park, Wee Sang; Kanaya, Haruichi20182018, vol.30, no.12 Pt.2



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