期刊


ISSN0914-4935
刊名Sensors and materials
参考译名传感器与材料
收藏年代1998～2023



全部

1998 1999 2000 2001 2002 2003
2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2014 2015
2016 2017 2018 2019 2020 2021
2022 2023

2018, vol.30, no.1 2018, vol.30, no.10 Pt.1 2018, vol.30, no.12 Pt.1 2018, vol.30, no.12 Pt.2 2018, vol.30, no.12 Pt.3 2018, vol.30, no.2
2018, vol.30, no.3 2018, vol.30, no.3 Pt.2 2018, vol.30, no.4 Pt.1 2018, vol.30, no.4 Pt.2 2018, vol.30, no.5 Pt.1 2018, vol.30, no.5 Pt.2
2018, vol.30, no.6 Pt.1 2018, vol.30, no.6 Pt.2 2018, vol.30, no.7 Pt.1 2018, vol.30, no.7 Pt.2 2018, vol.30, no.8 Pt.1 2018, vol.30, no.8 Pt.2
2018, vol.30, no.9 Pt.1 2018, vol.30, no.9 Pt.2

题名作者出版年年卷期
Integrated Microsystems for Smart ApplicationsMeinig, Marco; Hiller, Karla; Moebius, Martin; Vogel, Martina; Otto, Thomas; Kurth, Steffen; Voigt, Sven; Morschhauser, Andreas20182018, vol.30, no.4 Pt.1
Faster and More Cost-effective Way to Success in MEMS R&D by Open Collaboration in Tohoku UniversityTanaka, Shuji20182018, vol.30, no.4 Pt.1
Accelerating MEMS Development by Open Collaboration at Hands-On-Access Fab, Tohoku UniversityTotsu, Kentaro; Moriyama, Masaaki; Suzuki, Yukio; Esashi, Masayoshi20182018, vol.30, no.4 Pt.1
Gas Sensing System Composed of IC-foundry-compatible Microcantilever, Advanced Sensing Material, and Intelligent Signal ProcessingPeng, Xin; Xu, Pengcheng; Li, Xinxin; Yu, Haitao; Xu, Jiaqiang; Lv, Yanqing20182018, vol.30, no.4 Pt.1
Wafer-level Packaging, Equipment Made in House, and Heterogeneous IntegrationEsashi, Masayoshi20182018, vol.30, no.4 Pt.1
Translational Engineering: Best Practices in Developing MEMS for Volume ManufacturingFitzgerald, Alissa M.; Jackson, Keith M.; Chung, Charles C.; White, Carolyn D.20182018, vol.30, no.4 Pt.1
Trillion Sensors and MEMSKaminaga, Susumu20182018, vol.30, no.4 Pt.1
Development Services of MEMS-COREHomma, Koji20182018, vol.30, no.4 Pt.1
CMOS-MEMS Resonators and Oscillators: A ReviewChen, Chao-Yu; Li, Ming-Huang; Li, Sheng-Shian20182018, vol.30, no.4 Pt.1



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