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期刊
ISSN
0734-2101
刊名
Journal of Vacuum Science & Technology
参考译名
真空科学与技术,A辑:真空、表面与膜
收藏年代
2000~2013
全部
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2011, vol.29, no.1
2011, vol.29, no.2
2011, vol.29, no.3
2011, vol.29, no.4
2011, vol.29, no.5
2011, vol.29, no.6
题名
作者
出版年
年卷期
Status and potential of atmospheric plasma processing of materials
Daphne Pappas
2011
2011, vol.29, no.2
Physical vapor deposition and patterning of calcium fluoride films
L. Pinol; K. Rebello; K. Caruso; A. S. Francomacaro; G. L. Coles
2011
2011, vol.29, no.2
High-corrosion-resistant Al_2O_3 passivation-film formation by selective oxidation on austenitic stainless steel containing Al
Masafumi Kitano; Hidekazu Ishii; Yasuyuki Shirai; Tadahiro Ohmi
2011
2011, vol.29, no.2
MIAMI: Microscope and ion accelerator for materials investigations
J. A. Hinks; J. A. van den Berg; S. E. Donnelly
2011
2011, vol.29, no.2
Spectroscopic ellipsometry and X-ray photoelectron spectroscopy of La_2O_3 thin films deposited by reactive magnetron sputtering
V. V. Atuchin; A. V. Kalinkin; V. A. Kochubey; V. N. Kruchinin; R. S. Vemuri; C. V. Ramana
2011
2011, vol.29, no.2
Experimental evaluation of an adaptive Joule-Thomson cooling system including silicon-microfabricated heat exchanger and microvalve components
Weibin Zhu; Jong M. Park; Michael J. White; Gregory F. Nellis; Yogesh B. Gianchandani
2011
2011, vol.29, no.2
Formation of Pd nanocrystals in titanium-oxide film by rapid thermal annealing of reactively cosputtered TiPdO films
Wan-Yi Huang; Shi-Jin Ding; Hong-Bing Chen; Qing-Qing Sun; David Wei Zhang
2011
2011, vol.29, no.2
Surface activated bonding of copper through silicon vias and gold stud bumps at room temperature
M. M. R. Howlader; F. Zhang; M. J. Deen; T. Suga; A. Yamauchi
2011
2011, vol.29, no.2
Confirmation of sample quality: X-ray and ultraviolet photoelectron spectroscopies of uranium dioxide
S.-W. Yu; J. G. Tobin
2011
2011, vol.29, no.2
High rate deep Si etching for through-silicon via applications
Itsuko Sakai; Noriko Sakurai; Tokuhisa Ohiwa
2011
2011, vol.29, no.2
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