期刊


ISSN0734-2101
刊名Journal of Vacuum Science & Technology
参考译名真空科学与技术，A辑：真空、表面与膜
收藏年代2000～2013



全部

2000 2001 2002 2003 2004 2005
2006 2007 2008 2009 2010 2011
2012 2013

2005, vol.23, no.1 2005, vol.23, no.2 2005, vol.23, no.3 2005, vol.23, no.4 2005, vol.23, no.5 2005, vol.23, no.6

题名作者出版年年卷期
Hydrogen etching mechanism in nitrogen implanted iron alloys studied with in situ photoemission electron spectroscopyC. A. Figueroa; F. Alvarez20052005, vol.23, no.5
Ion chemistries in hexamethyldisiloxaneC. Q. Jiao; C. A. DeJoseph, Jr.; A. Garscadden20052005, vol.23, no.5
Changes in surface roughness and work function of indium-tin-oxide due to KrF excimer laser irradiationYow-Jon Lin; Iain D. Baikie; Wei-Yang Chou; Shin-Ting Lin; Hsing-Cheng Chang; Yao-Ming Chen; Wen-Fung Liu20052005, vol.23, no.5
Reproducible resistive switching in nonstoichiometric nickel oxide films grown by rf reactive sputtering for resistive random access memory applicationsJae-Wan Park; Jong-Wan Park; Dai-Young Kim; Jeon-Kook Lee20052005, vol.23, no.5
Towards the single pump solution: Recent development in high speed machines for dry vacuum pumpingA. D. Chew; M. Galtry; R. G. Livesey; I. Stones20052005, vol.23, no.5
Protection schemes for critical surface in vacuum environmentsJung Hyeun Kim; Christof Asbach; Se-Jin Yook; Heinz Fissan; Kevin J. Orvek; Arun Ramamoorthy; Pei-Yang Yan; David Y. H. Pui20052005, vol.23, no.5
Optical recording characteristics of WO{sub}3 films grown by pulsed laser deposition methodTakanori Aoki; Tatsuhiko Matsushita; Akio Suzuki; Kenji Tanabe; Masahiro Okuda20052005, vol.23, no.5
Numerical modeling of the Holweck pumpFelix Sharipov; Peter Fahrenbach; Andreas Zipp20052005, vol.23, no.5
Defect acceptor and donor in ion-bombarded GaNMladen Petravic; Victoria A. Coleman; Ki-Jeong Kim; Bongsoo Kim; Gang Li20052005, vol.23, no.5
Improvement of nitrogen retained dose using ammonia as a precursor in nitrogen plasma immersion ion implantation of siliconG. J. Wan; P. Yang; Ricky K. Y. Fu; Zh. Q. Yao; N. Huang; Paul K. Chu20052005, vol.23, no.5
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