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期刊
ISSN
1057-7157
刊名
Journal of Microelectromechanical Systems
参考译名
微机电系统杂志
收藏年代
1998~2013
全部
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2005
2006
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2013
2006, vol.15, no.1
2006, vol.15, no.2
2006, vol.15, no.3
2006, vol.15, no.4
2006, vol.15, no.5
2006, vol.15, no.6
题名
作者
出版年
年卷期
Programmable Reconfigurable Self-Assembly: Parallel Heterogeneous Integration of Chip-Scale Components on Planar and Nonplanar Surfaces
Jaehoon Chung; Wei Zheng; Thomas J. Hatch; Heiko O. Jacobs
2006
2006, vol.15, no.3
Piezoelectric Al{sub}0.3Ga{sub}0.7As Longitudinal Mode Bar Resonators
Lihua Li; Parshant Kumar; Lynn Calhoun; Don L. DeVoe
2006
2006, vol.15, no.3
Quality Factor in Trench-Refilled Polysilicon Beam Resonators
Reza Abdolvand; Houri Johari; Gavin K. Ho; Ahmet Erbil; Farrokh Ayazi
2006
2006, vol.15, no.3
Error Sources in In-Plane Silicon Tuning-Fork MEMS Gyroscopes
Marc S. Weinberg; Anthony Kourepenis
2006
2006, vol.15, no.3
A Micromachined Reaction Force Actuator (RFA) for a Nanomanipulator Preparation
Il-Han Hwang; Eui-Sung Yoon; Jong-Hyun Lee
2006
2006, vol.15, no.3
Lifetime Studies of Electrothermal Bent-Beam Actuators in Single-Crystal Silicon and Polysilicon
Larry L. Chu; Long Que; Andrew D. Oliver; Yogesh B. Gianchandani
2006
2006, vol.15, no.3
Encapsulated Submillimeter Piezoresistive Accelerometers
Woo-Tae Park; Aaron Partridge; Rob N. Candler; Vipin Ayanoor-Vitikkate; Gary Yama; Markus Lutz; Thomas W. Kenny
2006
2006, vol.15, no.3
Device-Level Hermetic Packaging of Microresonators by RTP Aluminum-to-Nitride Bonding
Mu Chiao; Liwei Lin
2006
2006, vol.15, no.3
Sea-of-Leads MEMS I/O Interconnects for Low-k IC Packaging
Bing Dang; Muhannad S. Bakir; Chirag S. Patel; Hiren D. Thacker; James D. Meindl
2006
2006, vol.15, no.3
Wafer-Level Packaging Based on Uniquely Orienting Serf-Assembly (The DUO-SPASS Processes)
Jiandong Fang; Karl F. Bohringer
2006
2006, vol.15, no.3
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